ASM is a supplier of semiconductor process equipment for wafer processing, including lithography, deposition, ion implant and single-wafer epitaxy. ASM is part of the ASM International NV group that also includes ASM Pacific Technology (ASMPT). ASMPT, in which ASMI holds a substantial ownership is a leading supplier of semiconductor process equipment for wafer assembly and packaging, and for surface mount technology.



AD881 with 8" x 5" dual workholders system

AD881

MS899

AD829

AD832i

AD420XL

AD420

AD220

AD9012TC

12" Automatic Die Bonder for stacked dice application.

LinDA

AD900

The ASM AD9312 is a cutting-edge wire bonder equipped with shared optics technology, enabling exceptional bonding accuracy. It incorporates intelligent bond head active tilting control and patented active vibration control to ensure high-quality bonding results with excellent coplanarity and stability.

AD9312

MS100 PLUSII

Flexible Epoxy Die Attach System with up to 3 wafers handling

AD881M

AD9012TS

MS899I-DIA

Flexible epoxy die attach system with up to 3 wafers handling and automatic substrate loading/unloading system.

AD881MH

AD8930U

AD8912SDCP

New generation SD8312 sets new industry record for 12” soft solder die bonding process
High-density leadframe handling with universal workholder design
High-speed performance combining proven technologies with high-tech innovations
Sophisticated oxygen level control
Capable of AB dice handling 

SD8312

AS809

Automatic Die Bonding System (12” wafer handling)
AD8312Plus: high-speed performance combining proven technologies with high-tech innovations.


AD8312 Plus

AD9012

AD830 Plus-R

Automatic Die Bonder for optical & photonic applications

AD210 Plus

AD900TS

WP808A

MS899I-DAL

The ASM AD8930V is a die bonder machine used in the semiconductor industry for attaching semiconductor chips to a substrate.

AD8930V

CM-LinDA

IS898

AD880

AD211

AD800

Automatic High Precision Die Attach System

AD280 Plus

The ASM IS868-LA3 is a die sorter machine used in the semiconductor industry for sorting semiconductor chips

IS868-LA3

Flexible Epoxy Die Attach System with automatic substrate load/unload system.

AD881H

Automatic high speed epoxy die bonder (Reel form materials handling)
Reel form materials handing e.g metal leaf frames or flex substrate, top LED etc.

AD838R

AD212

MS896A

AD210

AD9212

AD896-IL08

AD900A

AD9210

AD892M-06

Groundbreaking solution for large die handling

AD8312SD

AD830

The ASM AD898 is a state-of-the-art Die Bonder by ASM, representing a new generation of advanced technology. This fully automatic die bonding machine offers remarkable capabilities, accommodating up to 8" wafers. Its flexibility extends to handling a wide range of die sizes and leadframe/substrate configurations, allowing for quick and easy package conversion. Equipped with a fast and reliable linear bond head, high accuracy linear motor indexer platform, and high-speed Eagle Pattern Recognition System with pre/post bond inspection, the AD898 ensures precise and efficient die bonding processes. Additionally, it features a 2-in-1 epoxy writer system, further enhancing its capabilities for semiconductor manufacturing applications.

AD898

MS899-DL

The ASM AD838 is an automatic high-speed epoxy die bonder designed for efficiently bonding high-density lead frames, such as QFN, TQFP, PLCC, TSSOP, TSOP, SOT, and other similar packages. This die bonder is optimized for fast and accurate die bonding processes, making it ideal for semiconductor assembly applications requiring precise and reliable placement of dies on various lead frame types. 

AD838

ASMPT's ISLinDA is a cutting edge 12"; die bonder for stacked and thin die bonding capability. It is excellent in thin die handling employing various patented thin die ejecting systems. It can achieve high throughput and accuracy by a dual head system and a powerful vision system.

ISLinDA

AD860

MS100 Plus

MS100

AD8912 epoxy die bonder for 300mm wafers. With its capability to handle up to 300mm wafers, fully automatic operation, epoxy writer, pre and post bond inspection and wafer mapping.

AD8912

MS899-DLA

AD830UR

The newly developed ASM Die Bonder AD8312 offers a wide range of benefits with the sole target of producing highest speed and quality at lowest cost per die placement. Special handling and operating aspects of stacked and thin die are incorporated in the revolutionary machine concept. The extremely fast vision system and the ultra-light pick and place head with his innovative linear motor technology offer an incredible increase in performance, product quality and yield.

AD8312

IS8912DA

The ASM IS868LA2 is a die bonder machine used in the semiconductor industry for attaching semiconductor chips to a substrate

IS868LA2

IS898GA

The AD838L is a series of die bonders from ASMPT. It has an exclusive material handling capability, dragging-free indexing, and an advanced bond head design with patented technology that achieves high UPH. It can handle extra large substrates up to 300 mm x 100 mm and has a high precision bonding option that achieves ±15 μm @ 3σ XY placement accuracy.

AD838L

AD830U

AD862

The ASM AD8930 is a type of Physical Vapor Deposition (PVD) system produced by ASM International, a leading supplier of semiconductor manufacturing equipment. PVD is a thin film deposition technique used in various industries, including semiconductor, optics, and automotive, to deposit thin layers of materials onto a substrate.

AD8930

AD830 Plus

AB520A

IS898DA

Automatic Die Attach System
Accuracy ± 10 µm @ 3s 
Dual epoxy stamping / dispensing process
Direct ceramic substrate indexing

AD838L-G2

AD8912SD

The ASM MCM12 Die Sorter is a machine developed by ASM Pacific Technology, a leading supplier of semiconductor assembly and packaging equipment. The MCM12 Die Sorter is designed specifically for the sorting and handling of semiconductor dies, which are individual integrated circuit components that are separated from a wafer during the semiconductor manufacturing process.

MCM12

AS899

AD862H

AD819

AD862M

M899-DL

AD862MH

AD860M

SD890A

AD896

AD809

The ASM AD8930UV Automatic Die Bonder has a voltage of 240 volts, a frequency of 50/60 hertz, a phase of 3, and a current of 12 amps.

AD8930UV

AD828

The Twin832 is a high speed epoxy die bonder equipped with an innovative dual patented bond head system. It is suitable for handling a large range of IC/discrete packages, especially SiP, for multi-chip bonding for standalone or in-line machines. High density lead-frames can be applied in the Twin832 as its large range of work-holder track width maximizes customer’s productivity at low production cost.

TWIN832

AD889

AD8912R

IS9012TC

The ASM AD8312FC is an advanced Automatic Die Bonding System designed for handling 12-inch wafers. It offers the capability of direct die attach mode, in addition to the standard flip chip process. This system provides efficient and precise die bonding solutions, making it suitable for various semiconductor assembly applications, including direct die attach processes for specific requirements.

AD8312FC

GA-898CC

AD829A

WS896

MS 899I-DLA

MS896

AD832U

Automatic high precision epoxy die bonder
High precision bonding performance on QFN, TQFP, PLCC, TSOP, SOIC, SOT etc.

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

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AD832i

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