AD838P
Overview
Automatic high precision epoxy die bonder High precision bonding performance on QFN, TQFP, PLCC, TSOP, SOIC, SOT etc.
Active Listings
1
Services
Inspection, Insurance, Appraisal, Logistics
Automatic high precision epoxy die bonder High precision bonding performance on QFN, TQFP, PLCC, TSOP, SOIC, SOT etc.
1
Inspection, Insurance, Appraisal, Logistics