Description
No descriptionConfiguration
No ConfigurationOEM Model Description
Automatic high precision epoxy die bonder High precision bonding performance on QFN, TQFP, PLCC, TSOP, SOIC, SOT etc.Documents
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ASM
AD838P
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
83093
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
Automatic high precision epoxy die bonder High precision bonding performance on QFN, TQFP, PLCC, TSOP, SOIC, SOT etc.Documents
No documents