Description
Solidifying machine and laminating machine. AD838 is an automatic high speed epoxy die bonder with up to 4"(101.6 mm) substrate width handling capability, It is highly flexible in handling wide range of die sizes for your IC and discrete packages. Together with high precision linear motorizing system, patented bond head system, dual dispensing system and advanced inspection system, AD838 must be your only choice for die attach process.Configuration
No ConfigurationOEM Model Description
The ASM AD838 is an automatic high-speed epoxy die bonder designed for efficiently bonding high-density lead frames, such as QFN, TQFP, PLCC, TSSOP, TSOP, SOT, and other similar packages. This die bonder is optimized for fast and accurate die bonding processes, making it ideal for semiconductor assembly applications requiring precise and reliable placement of dies on various lead frame types.Documents
No documents
ASM
AD838
Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
79228
Wafer Sizes:
4"/100mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ASM
AD838
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
79228
Wafer Sizes:
4"/100mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Solidifying machine and laminating machine. AD838 is an automatic high speed epoxy die bonder with up to 4"(101.6 mm) substrate width handling capability, It is highly flexible in handling wide range of die sizes for your IC and discrete packages. Together with high precision linear motorizing system, patented bond head system, dual dispensing system and advanced inspection system, AD838 must be your only choice for die attach process.Configuration
No ConfigurationOEM Model Description
The ASM AD838 is an automatic high-speed epoxy die bonder designed for efficiently bonding high-density lead frames, such as QFN, TQFP, PLCC, TSSOP, TSOP, SOT, and other similar packages. This die bonder is optimized for fast and accurate die bonding processes, making it ideal for semiconductor assembly applications requiring precise and reliable placement of dies on various lead frame types.Documents
No documents