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ASM AD838
  • ASM AD838
  • ASM AD838
  • ASM AD838
  • ASM AD838
  • ASM AD838
Description
No description
Configuration
No Configuration
OEM Model Description
The ASM AD838 is an automatic high-speed epoxy die bonder designed for efficiently bonding high-density lead frames, such as QFN, TQFP, PLCC, TSSOP, TSOP, SOT, and other similar packages. This die bonder is optimized for fast and accurate die bonding processes, making it ideal for semiconductor assembly applications requiring precise and reliable placement of dies on various lead frame types.
Documents

No documents

verified-listing-icon

Verified

CATEGORY
Die Bonders / Sorters / Attachers

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

73861


Wafer Sizes:

Unknown


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
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ASM

AD838

verified-listing-icon
Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
listing-photo-5f8c4d3f01e94eeca36e78f7cf18fb2d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/49121/5f8c4d3f01e94eeca36e78f7cf18fb2d/4220c1779f7b4413849e29395ba39cad_a497e78c8745433ebbef2e2116e8fd731201a_mw.jpeg
listing-photo-5f8c4d3f01e94eeca36e78f7cf18fb2d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/49121/5f8c4d3f01e94eeca36e78f7cf18fb2d/46a6bbd00c0b482f8040094fcba5e248_4ebe274d3dd945fea8c526dee5b9d8e41201a_mw.jpeg
listing-photo-5f8c4d3f01e94eeca36e78f7cf18fb2d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/49121/5f8c4d3f01e94eeca36e78f7cf18fb2d/06f9bd95cd114160911123cf353149fc_5f19476d7c414b7da73bbe011e76f6be1201a_mw.jpeg
listing-photo-5f8c4d3f01e94eeca36e78f7cf18fb2d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/49121/5f8c4d3f01e94eeca36e78f7cf18fb2d/e0eeb956401a4eea8196fca71987e490_03e4c6e0724549d1b65eaf54d6005c1b1201a_mw.jpeg
listing-photo-5f8c4d3f01e94eeca36e78f7cf18fb2d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/49121/5f8c4d3f01e94eeca36e78f7cf18fb2d/6fc4aedcd5d24ef9939778be067a4538_518589ba84dd4de78c9886167034b312_mw.jpeg
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

73861


Wafer Sizes:

Unknown


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No description
Configuration
No Configuration
OEM Model Description
The ASM AD838 is an automatic high-speed epoxy die bonder designed for efficiently bonding high-density lead frames, such as QFN, TQFP, PLCC, TSSOP, TSOP, SOT, and other similar packages. This die bonder is optimized for fast and accurate die bonding processes, making it ideal for semiconductor assembly applications requiring precise and reliable placement of dies on various lead frame types.
Documents

No documents

Similar Listings
View All