Description
Fully functional, in production clean roomConfiguration
6, 8 and 12in wafer mounted on 17 in frameOEM Model Description
Mi20 is a full specification platform designed for wafer to reel process in WLCSP. Below are the key features of Mi20: • Provides throughput up to 20,000 UPH • Handles 12" wafer or below • Ability to handle die size of 0.3 x 0.3 mm or largerDocuments
MI EQUIPMENT
MI20
Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Installed / Running
Product ID:
106566
Wafer Sizes:
6"/150mm, 8"/200mm, 12"/300mm
Vintage:
2016
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
MI EQUIPMENT
MI20
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Installed / Running
Product ID:
106566
Wafer Sizes:
6"/150mm, 8"/200mm, 12"/300mm
Vintage:
2016
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available