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6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
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6" Fab For Sale from Moov - Click Here to Learn More
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MI EQUIPMENT MI20
    Description
    Status (Installed, De-installed): Installed
    Configuration
    No Configuration
    OEM Model Description
    Mi20 is a full specification platform designed for wafer to reel process in WLCSP. Below are the key features of Mi20: • Provides throughput up to 20,000 UPH • Handles 12" wafer or below • Ability to handle die size of 0.3 x 0.3 mm or larger
    Documents

    No documents

    MI EQUIPMENT

    MI20

    verified-listing-icon

    Verified

    CATEGORY
    Die Bonders / Sorters / Attachers

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    101657


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    MI EQUIPMENT MI20

    MI EQUIPMENT

    MI20

    Die Bonders / Sorters / Attachers
    Vintage: 2016Condition: Used
    Last VerifiedOver 60 days ago

    MI EQUIPMENT

    MI20

    verified-listing-icon
    Verified
    CATEGORY
    Die Bonders / Sorters / Attachers
    Last Verified: Over 60 days ago
    listing-photo-f2483289a6ff44d4be3e4d1bc6e07125-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    101657


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Status (Installed, De-installed): Installed
    Configuration
    No Configuration
    OEM Model Description
    Mi20 is a full specification platform designed for wafer to reel process in WLCSP. Below are the key features of Mi20: • Provides throughput up to 20,000 UPH • Handles 12" wafer or below • Ability to handle die size of 0.3 x 0.3 mm or larger
    Documents

    No documents

    Similar Listings
    View All
    MI EQUIPMENT MI20

    MI EQUIPMENT

    MI20

    Die Bonders / Sorters / AttachersVintage: 2016Condition: UsedLast Verified:Over 60 days ago
    MI EQUIPMENT MI20

    MI EQUIPMENT

    MI20

    Die Bonders / Sorters / AttachersVintage: 0Condition: UsedLast Verified:Over 60 days ago