Description
No descriptionConfiguration
Config: Cycle Time: 175ms XY Placement: +/- 1.5 mil Die Rotation: +/- 3degrees Collect type: Surface pick type Pick/Bond force: 40 - 250 g (adjustable) Bin frame capability: Max 150 100 - buffer bin cassette 25 - empty bin cassette 25 - finished bin cassette Bin Frame Size: 175 mm (I.D.) / 195 mm (O.D.) Effective binning area: 58 x 58 mm2 Size of mylar sheet: 195 x 195 mm2 Wafer loader capacity: Disco Ring 25 / Foton Ring 12 Die Size Handling w/look ahead - 9 x 9 mil2 - 50 x 50 mil2 (0.23 x 0.23 mm2 - 1.27 x 1.27 mm2) Die Size Handling w/o look ahead - 9 x 9 mil2 - 150 x 150 mil2 (0.23 x 0.23 mm2 - 3.81 x 3.81 mm2) Package Size handling w/look ahead - 240 x 240 mil2 Package Size handling w/o look ahead - 480 x 480 mil2 Dimensions: 1448mm x 1486mm x 1626 mm Weight: 1000 kg Power Requirements: 110 Volt - 50/60 HzOEM Model Description
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ASM
MS899-DLA
Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: 4 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
119175
Wafer Sizes:
Unknown
Vintage:
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ASM
MS899-DLA
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: 4 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
119175
Wafer Sizes:
Unknown
Vintage:
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Config: Cycle Time: 175ms XY Placement: +/- 1.5 mil Die Rotation: +/- 3degrees Collect type: Surface pick type Pick/Bond force: 40 - 250 g (adjustable) Bin frame capability: Max 150 100 - buffer bin cassette 25 - empty bin cassette 25 - finished bin cassette Bin Frame Size: 175 mm (I.D.) / 195 mm (O.D.) Effective binning area: 58 x 58 mm2 Size of mylar sheet: 195 x 195 mm2 Wafer loader capacity: Disco Ring 25 / Foton Ring 12 Die Size Handling w/look ahead - 9 x 9 mil2 - 50 x 50 mil2 (0.23 x 0.23 mm2 - 1.27 x 1.27 mm2) Die Size Handling w/o look ahead - 9 x 9 mil2 - 150 x 150 mil2 (0.23 x 0.23 mm2 - 3.81 x 3.81 mm2) Package Size handling w/look ahead - 240 x 240 mil2 Package Size handling w/o look ahead - 480 x 480 mil2 Dimensions: 1448mm x 1486mm x 1626 mm Weight: 1000 kg Power Requirements: 110 Volt - 50/60 HzOEM Model Description
None ProvidedDocuments
No documents