Description

Die Bonder

Configuration

No Configuration

OEM Model Description

ASMPT's ISLinDA is a cutting edge 12"; die bonder for stacked and thin die bonding capability. It is excellent in thin die handling employing various patented thin die ejecting systems. It can achieve high throughput and accuracy by a dual head system and a powerful vision system.

Documents

No documents

ASM

ISLinDA

Verified

Die Bonders / Sorters / Attachers

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used

Operational Status:

Unknown

Product ID:

129159

Wafer Sizes:

Unknown

Vintage:

Unknown

Logistics Support

Available

Transaction Insured by Moov

Available

Refurbishment Services

Available

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