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Description
Die bonderConfiguration
No ConfigurationOEM Model Description
ASMPT's ISLinDA is a cutting edge 12"; die bonder for stacked and thin die bonding capability. It is excellent in thin die handling employing various patented thin die ejecting systems. It can achieve high throughput and accuracy by a dual head system and a powerful vision system.Documents
No documents
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
65362
Wafer Sizes:
Unknown
Vintage:
2018
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
65362
Wafer Sizes:
Unknown
Vintage:
2018
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Die bonderConfiguration
No ConfigurationOEM Model Description
ASMPT's ISLinDA is a cutting edge 12"; die bonder for stacked and thin die bonding capability. It is excellent in thin die handling employing various patented thin die ejecting systems. It can achieve high throughput and accuracy by a dual head system and a powerful vision system.Documents
No documents