Description

Solidifying machine and laminating machine

Configuration

No Configuration

OEM Model Description

The ASM AD898 is a state-of-the-art Die Bonder by ASM, representing a new generation of advanced technology. This fully automatic die bonding machine offers remarkable capabilities, accommodating up to 8" wafers. Its flexibility extends to handling a wide range of die sizes and leadframe/substrate configurations, allowing for quick and easy package conversion. Equipped with a fast and reliable linear bond head, high accuracy linear motor indexer platform, and high-speed Eagle Pattern Recognition System with pre/post bond inspection, the AD898 ensures precise and efficient die bonding processes. Additionally, it features a 2-in-1 epoxy writer system, further enhancing its capabilities for semiconductor manufacturing applications.

Documents

No documents

ASM

AD898

Verified

Die Bonders / Sorters / Attachers

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used

Operational Status:

Unknown

Product ID:

79198

Wafer Sizes:

Unknown

Vintage:

2005

Logistics Support

Available

Transaction Insured by Moov

Available

Refurbishment Services

Available

Similar Listings