Description
Includes, 6” and 8” wafer Film frame expander changeover kits, alignment tools and full set of handbook.Configuration
No ConfigurationOEM Model Description
The ASM AD898 is a state-of-the-art Die Bonder by ASM, representing a new generation of advanced technology. This fully automatic die bonding machine offers remarkable capabilities, accommodating up to 8" wafers. Its flexibility extends to handling a wide range of die sizes and leadframe/substrate configurations, allowing for quick and easy package conversion. Equipped with a fast and reliable linear bond head, high accuracy linear motor indexer platform, and high-speed Eagle Pattern Recognition System with pre/post bond inspection, the AD898 ensures precise and efficient die bonding processes. Additionally, it features a 2-in-1 epoxy writer system, further enhancing its capabilities for semiconductor manufacturing applications.Documents
No documents
ASM
AD898
Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: 18 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
13138
Wafer Sizes:
6"/150mm, 8"/200mm
Vintage:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View All
ASM
AD898
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: 18 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
13138
Wafer Sizes:
6"/150mm, 8"/200mm
Vintage:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Includes, 6” and 8” wafer Film frame expander changeover kits, alignment tools and full set of handbook.Configuration
No ConfigurationOEM Model Description
The ASM AD898 is a state-of-the-art Die Bonder by ASM, representing a new generation of advanced technology. This fully automatic die bonding machine offers remarkable capabilities, accommodating up to 8" wafers. Its flexibility extends to handling a wide range of die sizes and leadframe/substrate configurations, allowing for quick and easy package conversion. Equipped with a fast and reliable linear bond head, high accuracy linear motor indexer platform, and high-speed Eagle Pattern Recognition System with pre/post bond inspection, the AD898 ensures precise and efficient die bonding processes. Additionally, it features a 2-in-1 epoxy writer system, further enhancing its capabilities for semiconductor manufacturing applications.Documents
No documents