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ASM AD898
  • ASM AD898
  • ASM AD898
  • ASM AD898
  • ASM AD898
  • ASM AD898
  • ASM AD898
  • ASM AD898
  • ASM AD898
Description
Includes, 6” and 8” wafer Film frame expander changeover kits, alignment tools and full set of handbook.
Configuration
No Configuration
OEM Model Description
The ASM AD898 is a state-of-the-art Die Bonder by ASM, representing a new generation of advanced technology. This fully automatic die bonding machine offers remarkable capabilities, accommodating up to 8" wafers. Its flexibility extends to handling a wide range of die sizes and leadframe/substrate configurations, allowing for quick and easy package conversion. Equipped with a fast and reliable linear bond head, high accuracy linear motor indexer platform, and high-speed Eagle Pattern Recognition System with pre/post bond inspection, the AD898 ensures precise and efficient die bonding processes. Additionally, it features a 2-in-1 epoxy writer system, further enhancing its capabilities for semiconductor manufacturing applications.
Documents

No documents

verified-listing-icon

Verified

CATEGORY
Die Bonders / Sorters / Attachers

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

13138


Wafer Sizes:

6"/150mm, 8"/200mm


Vintage:

2006


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ASM

AD898

verified-listing-icon
Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
listing-photo-5Dlb0NRUPp1Cjh3ZhYhizDIeFFYPf22Di57JId5RA6M-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1898/5Dlb0NRUPp1Cjh3ZhYhizDIeFFYPf22Di57JId5RA6M/6ee1d2f11913489a8d07c4c3913e256c_3947a5ed77c2438e88538758a38d4ffe_mw.jpeg
listing-photo-5Dlb0NRUPp1Cjh3ZhYhizDIeFFYPf22Di57JId5RA6M-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1898/5Dlb0NRUPp1Cjh3ZhYhizDIeFFYPf22Di57JId5RA6M/d212444f34f64db6a2c73886343659b4_49868f079ae741529ab23f366319b30a_mw.jpeg
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listing-photo-5Dlb0NRUPp1Cjh3ZhYhizDIeFFYPf22Di57JId5RA6M-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1898/5Dlb0NRUPp1Cjh3ZhYhizDIeFFYPf22Di57JId5RA6M/997264129c604586b522eabc994a848f_aad60f99e5ba4f1797c0ee7734200477_mw.jpeg
listing-photo-5Dlb0NRUPp1Cjh3ZhYhizDIeFFYPf22Di57JId5RA6M-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1898/5Dlb0NRUPp1Cjh3ZhYhizDIeFFYPf22Di57JId5RA6M/a12d9536241d4148a2602a456959c9b1_6b11832c72c6496f87445d0b319a38d5_mw.jpeg
listing-photo-5Dlb0NRUPp1Cjh3ZhYhizDIeFFYPf22Di57JId5RA6M-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1898/5Dlb0NRUPp1Cjh3ZhYhizDIeFFYPf22Di57JId5RA6M/0204f4f899444b2b999410455336dd44_65852cc68c9f431ea5bac894b9524d8a1201a_mw.jpeg
listing-photo-5Dlb0NRUPp1Cjh3ZhYhizDIeFFYPf22Di57JId5RA6M-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1898/5Dlb0NRUPp1Cjh3ZhYhizDIeFFYPf22Di57JId5RA6M/933721f5b41c44538296a3ed4493b3cb_7fd04cf1e9b94855a3a3d0fbeefa653b1201a_mw.jpeg
listing-photo-5Dlb0NRUPp1Cjh3ZhYhizDIeFFYPf22Di57JId5RA6M-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1898/5Dlb0NRUPp1Cjh3ZhYhizDIeFFYPf22Di57JId5RA6M/2221fd7ec2d54e318805b01baf0ea112_88fb7e6142194edfb45302bb9a048a8b1201a_mw.jpeg
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

13138


Wafer Sizes:

6"/150mm, 8"/200mm


Vintage:

2006


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Includes, 6” and 8” wafer Film frame expander changeover kits, alignment tools and full set of handbook.
Configuration
No Configuration
OEM Model Description
The ASM AD898 is a state-of-the-art Die Bonder by ASM, representing a new generation of advanced technology. This fully automatic die bonding machine offers remarkable capabilities, accommodating up to 8" wafers. Its flexibility extends to handling a wide range of die sizes and leadframe/substrate configurations, allowing for quick and easy package conversion. Equipped with a fast and reliable linear bond head, high accuracy linear motor indexer platform, and high-speed Eagle Pattern Recognition System with pre/post bond inspection, the AD898 ensures precise and efficient die bonding processes. Additionally, it features a 2-in-1 epoxy writer system, further enhancing its capabilities for semiconductor manufacturing applications.
Documents

No documents

Similar Listings
View All