Description
VIA WConfiguration
VIA WOEM Model Description
Employing a unique, “selective” suppression mechanism, the Centura® iSprint™ ALD/CVD SSW process delivers the industry’s first bottom-up CVD W gap fill, free of voids and seams. It optimizes the volume of W, creating more robust features and helping to improve yield.Documents
No documents
CATEGORY
Deposition
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
91266
Wafer Sizes:
12"/300mm
Vintage:
2006
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
CENTURA AP ISPRINT
CATEGORY
Deposition
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
91266
Wafer Sizes:
12"/300mm
Vintage:
2006
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
VIA WConfiguration
VIA WOEM Model Description
Employing a unique, “selective” suppression mechanism, the Centura® iSprint™ ALD/CVD SSW process delivers the industry’s first bottom-up CVD W gap fill, free of voids and seams. It optimizes the volume of W, creating more robust features and helping to improve yield.Documents
No documents