CENTURA AP ISPRINT
Category
DepositionOverview
Employing a unique, “selective” suppression mechanism, the Centura® iSprint™ ALD/CVD SSW process delivers the industry’s first bottom-up CVD W gap fill, free of voids and seams. It optimizes the volume of W, creating more robust features and helping to improve yield.
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APPLIED MATERIALS (AMAT)
CENTURA AP ISPRINT
DepositionVintage: Condition: UsedLast VerifiedYesterdayAPPLIED MATERIALS (AMAT)
CENTURA AP ISPRINT
DepositionVintage: Condition: UsedLast VerifiedYesterdayAPPLIED MATERIALS (AMAT)
CENTURA AP ISPRINT
DepositionVintage: 2006Condition: UsedLast VerifiedOver 60 days ago
