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Description
Macro-DefectConfiguration
No ConfigurationOEM Model Description
The 2401 Automated Macro Defect Inspection System is a product by KLA-Tencor that replaces manual bright light macro defect inspection performed by operators. It provides automated detection, classification, and reporting of all yield-critical macro after-develop inspection defect types, including hotspots, scratches, large particles, extra and missing resist, unexposed fields, striations, developer spots and splashback. With sensitivity superior to that of operators, the 2401 Automated Macro Defect Inspection System detects defects reliably and repeatably, allowing for quick and accurate disposition decisions, reducing scrap and preventing further investment in low-yielding wafers.Documents
No documents
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
119863
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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KLA
2401
CATEGORY
Defect Inspection
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
119863
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Macro-DefectConfiguration
No ConfigurationOEM Model Description
The 2401 Automated Macro Defect Inspection System is a product by KLA-Tencor that replaces manual bright light macro defect inspection performed by operators. It provides automated detection, classification, and reporting of all yield-critical macro after-develop inspection defect types, including hotspots, scratches, large particles, extra and missing resist, unexposed fields, striations, developer spots and splashback. With sensitivity superior to that of operators, the 2401 Automated Macro Defect Inspection System detects defects reliably and repeatably, allowing for quick and accurate disposition decisions, reducing scrap and preventing further investment in low-yielding wafers.Documents
No documents