Description
KLA-Tencor Candela 8600 Optical Surface Analyzer (OSA) is a laser-based inspection system for semiconductor and optoelectronic wafers. It is manual wafer handling tool. The Candela defect detection system simultaneously measures surface reflectivity and topography for automatic defect detection and classification. The defect detection system's inspection technology combines scatterometry, ellipsometry, reflectometry, and topographical analysis to non-destructively inspect wafer surfaces for defects, and film thickness uniformity, of opaque substrates, epi layers, and transparent film coatings (SiC, GaN, sapphire). *. Fully refurbished. Installed in Clean-room. Can demonstrate anytime.Configuration
KLA-Tencor Candela 8600 Working - Laser: Oblique(50mW, 405nm), Normal(85mW, 660nm) - Spot size: 5㎛ x 4㎛. - Particle detection: smaller than 0.08㎛ on silicon substrate. - Scratch: 0.1㎛ wide, 1~2nm deep. - Pits and Bumps: 20㎛ diameter, 50Å; deep. - Stains: 20㎛ diameter, 10Å; thick. - can be used for both epi and bare substrate. - can be used for Si, GaAs, Al2O3,SiC substrate. - Substrage thickness: 350㎛ ~ 1,300㎛. - Air Balance system ULPA and HEPA air filter(replaced new one). - Input Power 230V 5A 50/60Hz - Input Air: CDA 90 PSIOEM Model Description
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KLA
CANDELA 8600
Verified
CATEGORY
Defect Inspection
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
65983
Wafer Sizes:
8"/200mm
Vintage:
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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KLA
CANDELA 8600
CATEGORY
Defect Inspection
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
65983
Wafer Sizes:
8"/200mm
Vintage:
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
KLA-Tencor Candela 8600 Optical Surface Analyzer (OSA) is a laser-based inspection system for semiconductor and optoelectronic wafers. It is manual wafer handling tool. The Candela defect detection system simultaneously measures surface reflectivity and topography for automatic defect detection and classification. The defect detection system's inspection technology combines scatterometry, ellipsometry, reflectometry, and topographical analysis to non-destructively inspect wafer surfaces for defects, and film thickness uniformity, of opaque substrates, epi layers, and transparent film coatings (SiC, GaN, sapphire). *. Fully refurbished. Installed in Clean-room. Can demonstrate anytime.Configuration
KLA-Tencor Candela 8600 Working - Laser: Oblique(50mW, 405nm), Normal(85mW, 660nm) - Spot size: 5㎛ x 4㎛. - Particle detection: smaller than 0.08㎛ on silicon substrate. - Scratch: 0.1㎛ wide, 1~2nm deep. - Pits and Bumps: 20㎛ diameter, 50Å; deep. - Stains: 20㎛ diameter, 10Å; thick. - can be used for both epi and bare substrate. - can be used for Si, GaAs, Al2O3,SiC substrate. - Substrage thickness: 350㎛ ~ 1,300㎛. - Air Balance system ULPA and HEPA air filter(replaced new one). - Input Power 230V 5A 50/60Hz - Input Air: CDA 90 PSIOEM Model Description
None ProvidedDocuments
No documents