Description
Darkfield inspectionConfiguration
-Software Version: Windows -CIM: Yes -Process: Wafer scanning -Main System TESTER SIDE (1) -Handler System WAFER HANDLER SYSTEM (1) -Factory Interface FOUP (2) -Auxillary Rack (1)OEM Model Description
The AIT XUV is KLA-Tencor’s next-generation double-darkfield optical inspection tool. It offers higher throughput and sensitivity for 65-nm production requirements, with a wide range of spot sizes and advanced detection algorithms. It also features an auto-positioning system, autofocus unit, and iADC capability for faster results. It is field upgradeable from the AIT UV platform and provides detection capability for current-layer defects at speeds up to three times faster than the prior-generation AIT XP system, with improved focus, tracking performance, and die-to-die registration.Documents
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KLA
AIT XUV
Verified
CATEGORY
Defect Inspection
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
113031
Wafer Sizes:
12"/300mm
Vintage:
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View AllKLA
AIT XUV
CATEGORY
Defect Inspection
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
113031
Wafer Sizes:
12"/300mm
Vintage:
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Darkfield inspectionConfiguration
-Software Version: Windows -CIM: Yes -Process: Wafer scanning -Main System TESTER SIDE (1) -Handler System WAFER HANDLER SYSTEM (1) -Factory Interface FOUP (2) -Auxillary Rack (1)OEM Model Description
The AIT XUV is KLA-Tencor’s next-generation double-darkfield optical inspection tool. It offers higher throughput and sensitivity for 65-nm production requirements, with a wide range of spot sizes and advanced detection algorithms. It also features an auto-positioning system, autofocus unit, and iADC capability for faster results. It is field upgradeable from the AIT UV platform and provides detection capability for current-layer defects at speeds up to three times faster than the prior-generation AIT XP system, with improved focus, tracking performance, and die-to-die registration.Documents
No documents