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KLA 2800
  • KLA 2800
  • KLA 2800
  • KLA 2800
Description
KLA2800 Lamp
Configuration
No Configuration
OEM Model Description
The 2800 Series is a next-generation broadband DUV/UV/VIS patterned wafer inspection platform for sub-65-nm design rule development and production. It delivers maximum sensitivity, 2X better throughput than previous-generation DUV tools, and has a roadmap that extends to 45-nm and beyond design rules. It offers an array of optical modes and accelerates time to results with advanced binning and realtime defect classification. The 2800 Series is suited for unique applications such as Photo Cell Monitoring, Process Window Qualification, and Micro After-Develop Inspection. It complements the Puma 9000 Series darkfield platform and eS3x electron-beam inspection system to enable a comprehensive defect inspection strategy.
Documents

No documents

verified-listing-icon

Verified

CATEGORY
Defect Inspection

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

101300


Wafer Sizes:

12"/300mm


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

KLA

2800

verified-listing-icon
Verified
CATEGORY
Defect Inspection
Last Verified: Over 60 days ago
listing-photo-7b4aeb4b4ac040f7a5eb3f9fc9d59386-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

101300


Wafer Sizes:

12"/300mm


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
KLA2800 Lamp
Configuration
No Configuration
OEM Model Description
The 2800 Series is a next-generation broadband DUV/UV/VIS patterned wafer inspection platform for sub-65-nm design rule development and production. It delivers maximum sensitivity, 2X better throughput than previous-generation DUV tools, and has a roadmap that extends to 45-nm and beyond design rules. It offers an array of optical modes and accelerates time to results with advanced binning and realtime defect classification. The 2800 Series is suited for unique applications such as Photo Cell Monitoring, Process Window Qualification, and Micro After-Develop Inspection. It complements the Puma 9000 Series darkfield platform and eS3x electron-beam inspection system to enable a comprehensive defect inspection strategy.
Documents

No documents