Overview

The 2800 Series is a next-generation broadband DUV/UV/VIS patterned wafer inspection platform for sub-65-nm design rule development and production. It delivers maximum sensitivity, 2X better throughput than previous-generation DUV tools, and has a roadmap that extends to 45-nm and beyond design rules. It offers an array of optical modes and accelerates time to results with advanced binning and realtime defect classification. The 2800 Series is suited for unique applications such as Photo Cell Monitoring, Process Window Qualification, and Micro After-Develop Inspection. It complements the Puma 9000 Series darkfield platform and eS3x electron-beam inspection system to enable a comprehensive defect inspection strategy.