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APPLIED MATERIALS (AMAT) UVISION 5
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    OEM Model Description
    The Applied UVision 5 wafer inspection system detects yield-limiting defects in the critical patterning layers of 22nm and below logic and memory devices. Applied also offers the Applied DFinder system, the first darkfield wafer inspection system to use DUV laser scanning to detect particles as small as 40nm in interconnect layers. The UVision® 5 system isa member of the UVision wafer inspection product family, supporting the same proprietary core technology of deep ultraviolet (DUV) laser illumination, with simultaneous dual channel [brightfield (BF) reflected light and grayfield (GF) scattered light] collection optics. The system exhibits new defect inspection capabilities on advanced patterning layers in both FEOL and BEOL applications for 2xnm production and beyond, addressing such technologies as ArF immersion lithography, double and quad patterning, and extreme ultraviolet layers. The UVision 5 system’s dramatically increased light density enables detection of 1xnm killer defects - some never captured before - resulting in a twofold improvement in killer defect capture rates. This, in turn, results in a more accurate and comprehensive defect Pareto that significantly improves statistical process control in the wafer fab. The platform’s unique GF detection architecture now captures more light to enable detection of defects in the range of 1xnm (approximately the width of up to five DNA strands). New imaging modes improve detection sensitivity to further increase UVision technology leadership in GF scanning. Novel image processing algorithms reduce wafer noise by up to 50% in various types of memory structures, contributing to a higher capture rate, especially on BEOL layers.
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    APPLIED MATERIALS (AMAT)

    UVISION 5

    verified-listing-icon

    Verified

    CATEGORY
    Defect Inspection

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    105881


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
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    Transaction Insured by Moov
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    Refurbishment Services
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    APPLIED MATERIALS (AMAT) UVISION 5

    APPLIED MATERIALS (AMAT)

    UVISION 5

    Defect Inspection
    Vintage: 0Condition: Used
    Last Verified11 days ago

    APPLIED MATERIALS (AMAT)

    UVISION 5

    verified-listing-icon
    Verified
    CATEGORY
    Defect Inspection
    Last Verified: Over 60 days ago
    listing-photo-239cb2608ac74ba6b987633396d54a92-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    105881


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The Applied UVision 5 wafer inspection system detects yield-limiting defects in the critical patterning layers of 22nm and below logic and memory devices. Applied also offers the Applied DFinder system, the first darkfield wafer inspection system to use DUV laser scanning to detect particles as small as 40nm in interconnect layers. The UVision® 5 system isa member of the UVision wafer inspection product family, supporting the same proprietary core technology of deep ultraviolet (DUV) laser illumination, with simultaneous dual channel [brightfield (BF) reflected light and grayfield (GF) scattered light] collection optics. The system exhibits new defect inspection capabilities on advanced patterning layers in both FEOL and BEOL applications for 2xnm production and beyond, addressing such technologies as ArF immersion lithography, double and quad patterning, and extreme ultraviolet layers. The UVision 5 system’s dramatically increased light density enables detection of 1xnm killer defects - some never captured before - resulting in a twofold improvement in killer defect capture rates. This, in turn, results in a more accurate and comprehensive defect Pareto that significantly improves statistical process control in the wafer fab. The platform’s unique GF detection architecture now captures more light to enable detection of defects in the range of 1xnm (approximately the width of up to five DNA strands). New imaging modes improve detection sensitivity to further increase UVision technology leadership in GF scanning. Novel image processing algorithms reduce wafer noise by up to 50% in various types of memory structures, contributing to a higher capture rate, especially on BEOL layers.
    Documents

    No documents

    Similar Listings
    View All
    APPLIED MATERIALS (AMAT) UVISION 5

    APPLIED MATERIALS (AMAT)

    UVISION 5

    Defect InspectionVintage: 0Condition: UsedLast Verified:11 days ago
    APPLIED MATERIALS (AMAT) UVISION 5

    APPLIED MATERIALS (AMAT)

    UVISION 5

    Defect InspectionVintage: 2011Condition: UsedLast Verified:Over 60 days ago
    APPLIED MATERIALS (AMAT) UVISION 5

    APPLIED MATERIALS (AMAT)

    UVISION 5

    Defect InspectionVintage: 2011Condition: UsedLast Verified:Over 30 days ago