Description
Bright FieldConfiguration
Parts Sale Available If you need any demand for specific parts, please inquire.OEM Model Description
The Applied UVision® 4 wafer Inspection system was introduced in 2010, enabling customers to detect yield-limiting defects in the critical patterning layers of 32nm and below logic and memory devices using DUV laser-based imaging technology. The UVision 4 system’s extendable architecture of high-power polarized deep ultra-violet laser, optimized scattered light collection, and advanced noise reduction capabilities, addresses the inspection challenges of 32nm and below with optical inspection capabilities beyond the resolution limits of conventional brightfield (BF) inspection. Innovative algorithms enable simultaneous detection of systematic mask induced defects (i.e., "haze" defects) and random defects at production worthy throughput made possible by an enhanced image processor. Wide dynamic range detection schemes eliminate the multiple region-specific scans previously required, enabling regions of a chip with differing contrasts to be imaged with optimal sensitivity in a single pass without compromising throughput.Documents
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APPLIED MATERIALS (AMAT)
UVISION 4
Verified
CATEGORY
Defect Inspection
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
95417
Wafer Sizes:
12"/300mm
Vintage:
Unknown
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Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
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Refurbishment Services
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APPLIED MATERIALS (AMAT)
UVISION 4
Verified
CATEGORY
Defect Inspection
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
95417
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Bright FieldConfiguration
Parts Sale Available If you need any demand for specific parts, please inquire.OEM Model Description
The Applied UVision® 4 wafer Inspection system was introduced in 2010, enabling customers to detect yield-limiting defects in the critical patterning layers of 32nm and below logic and memory devices using DUV laser-based imaging technology. The UVision 4 system’s extendable architecture of high-power polarized deep ultra-violet laser, optimized scattered light collection, and advanced noise reduction capabilities, addresses the inspection challenges of 32nm and below with optical inspection capabilities beyond the resolution limits of conventional brightfield (BF) inspection. Innovative algorithms enable simultaneous detection of systematic mask induced defects (i.e., "haze" defects) and random defects at production worthy throughput made possible by an enhanced image processor. Wide dynamic range detection schemes eliminate the multiple region-specific scans previously required, enabling regions of a chip with differing contrasts to be imaged with optimal sensitivity in a single pass without compromising throughput.Documents
No documents
Similar Listings
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Defect InspectionVintage: 0Condition: UsedLast Verified: Over 60 days agoAPPLIED MATERIALS (AMAT)
UVISION 4
Defect InspectionVintage: 2009Condition: UsedLast Verified: Over 60 days agoAPPLIED MATERIALS (AMAT)