We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. Read More
Description
No descriptionConfiguration
Category CVD ALTUS PNL With HD 2CH, RPS, Gas Box, Chamber Complect Brooks robot,3 ports Power BoxOEM Model Description
Concept Three ALTUS is a 300mm process module that delivers leading productivity and technology for contact and local interconnect applications. It uses Pulsed Nucleation Layer (PNL™) technology to integrate a high throughput nucleation layer with chemical vapor deposition (CVD bulk deposition). The Multi-Station Sequential Deposition (MSSD) architecture enables the nucleation layer and CVD fill to be performed within the same ALTUS chamber. This results in highly conformal tungsten films with improved film properties, benchmark productivity, and superior production availability. The integrated PNL and CVD approach produces the lowest Cost of Ownership tungsten deposition solution in the industry.Documents
No documents
CATEGORY
CVD
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
118047
Wafer Sizes:
12"/300mm
Vintage:
2003
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View All
LAM RESEARCH / NOVELLUS
CONCEPT THREE "C3" ALTUS
CATEGORY
CVD
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
118047
Wafer Sizes:
12"/300mm
Vintage:
2003
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Category CVD ALTUS PNL With HD 2CH, RPS, Gas Box, Chamber Complect Brooks robot,3 ports Power BoxOEM Model Description
Concept Three ALTUS is a 300mm process module that delivers leading productivity and technology for contact and local interconnect applications. It uses Pulsed Nucleation Layer (PNL™) technology to integrate a high throughput nucleation layer with chemical vapor deposition (CVD bulk deposition). The Multi-Station Sequential Deposition (MSSD) architecture enables the nucleation layer and CVD fill to be performed within the same ALTUS chamber. This results in highly conformal tungsten films with improved film properties, benchmark productivity, and superior production availability. The integrated PNL and CVD approach produces the lowest Cost of Ownership tungsten deposition solution in the industry.Documents
No documents
Similar Listings
View AllLAM RESEARCH / NOVELLUS
CONCEPT THREE "C3" ALTUS
CVDVintage: 2003Condition: UsedLast Verified:Over 30 days agoPREFERRED