Description
HDP CVD (Chemical Vapor Deposition)Configuration
No ConfigurationOEM Model Description
Centura Ultima HDP 200mm and 300mm systems deliver a high-density plasma CVD process. It has been the industry-leading workhorse delivering high-quality dielectric films and void-free gapfill. Its reactor enables customers to achieve the productivity, cost-efficiency, and extendibility needed for multi-generation manufacturing. The Ultima HDP system features dual RF coils for superior gap-fill capability across the wafer; its innovative electrostatic chuck enables excellent film quality and uniformity; combined with remote plasma clean, it delivers exceptional defect and mean-wafer-between-clean performance. The product’s advanced technology enables deposition of both undoped and doped films for a wide range of applications, including STI, PMD, ILD, IMD, and passivation. Its versatility further extends to etchback and high-density plasma treatment for improved film quality.Documents
No documents
CATEGORY
CVD
Last Verified: 8 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
147499
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
CENTURA ULTIMA TE
CATEGORY
CVD
Last Verified: 8 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
147499
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
HDP CVD (Chemical Vapor Deposition)Configuration
No ConfigurationOEM Model Description
Centura Ultima HDP 200mm and 300mm systems deliver a high-density plasma CVD process. It has been the industry-leading workhorse delivering high-quality dielectric films and void-free gapfill. Its reactor enables customers to achieve the productivity, cost-efficiency, and extendibility needed for multi-generation manufacturing. The Ultima HDP system features dual RF coils for superior gap-fill capability across the wafer; its innovative electrostatic chuck enables excellent film quality and uniformity; combined with remote plasma clean, it delivers exceptional defect and mean-wafer-between-clean performance. The product’s advanced technology enables deposition of both undoped and doped films for a wide range of applications, including STI, PMD, ILD, IMD, and passivation. Its versatility further extends to etchback and high-density plasma treatment for improved film quality.Documents
No documents