APPLIED MATERIALS (AMAT) Centura Ultima Plus

Description

200 mm Three-Chamber Ultima+ HDP CVD System Details Attached

Configuration

System Architecture & Wafer Handling • Chamber Position A, B, & C: HDP Ultima+ CVD Process Chambers • Chamber Position D: None (Open) • Chamber Position E: Multi-Slot Cooldown Chamber • Chamber Position F: Standard Orienter with One-OCP Control kit (Si, Clear, and SiC capable) • Transfer Robot: HP+ extended-reach robot • Load-Lock Type: Narrow-body load locks with automatic tilt-out • Cassette Capacity: 25-slot cassette • Wafer Alignment: On-the-fly center finding and Fast wafer mapping • Process Slit Valves: BKM valves at Positions A, B, and C • Transfer Purge: 500 sccm N2 transfer-chamber purge MFC • Mainframe Nitrogen: Regulated to 30 psi Chamber Type: HDP Ultima+ CVD O-Rings: Chemraz / Kalrez 9100 Uniformity Option: Enhanced uniformity Gas Distribution: 24-nozzle configuration (P/N 0200-18093) Electrostatic Chuck: HDP ESC (P/N 0040-18219) Cathode Base: Temperature-mixed HDP CVD Ultima cathode base (P/N 0040-05887) Turbo Pump: Ebara 1604-new Throttle / Gate Valve: Pfeiffer pendulum valve Remote Clean Generator: Top-mounted MKS Astron AX7670-refurbished Wafer Temperature Monitor (WTM): Included Individual Heated Cathode (IHC): 10/10 standard Coil Configuration: Balance upper coil Pressure Measurement Instrumentation • 0.10–100 Torr Transducer: P/N 1350-01284; 1/4 VCR, ±15 VDC, 15-pin D-sub • 10 Torr Set-Point Transducer: P/N 1350-01096; 1/4 VCR, ±15 VDC, 15-pin D-sub • 1000 Torr Transducer: P/N 1350-01131; 1/4 VCR, 1%, 9-pin D-sub Controls, Interfaces & Power • Controller Interface: Seriplex controller gas-panel interface card with V452 SBC • Monitors: Two flat-panel monitors • Communications Protocol: SECS via RS-232 • Controller GFCI: 100/200 mA GFCI • Exhaust Type: Top exhaust • Signal Tower: Front-mounted red/amber/green 3-light tower • Pump Interfaces: Provisions for load-lock, transfer, and process-chamber pumps (Chambers A, B, C) Configurable Options • Gas Delivery System: Tailored gas-panel/pallet configuration; gas species, MFC ranges, line assignments, valve types, regulators, filters, and pressure transducers customizable upon request. • RF Generator Package: Selectable generator models for Chambers A, B, and C. Reference offerings include ENI, Finesse ACME, Kyosan, and Advanced Energy OPTI / Paramount (+) racks. • Heat Exchanger / Chiller: Sized to match thermal load and facility requirements; hose and cable lengths customizable.

OEM Model Description

RPS Ultima Plus IS a reactor Equipment that operates on HDP CVD System that can process Wafers of 6”. It is enhanced with two Ultima Plus chambers. The main function of the machine is deposition of undoped and doped layers.