Description
Development_CVD_TiTIN Minimum 200 mm Maximum 200 mm Exterior Dimensions Width 79.921 in (203.0 cm) Depth 98.425 in (250.0 cm) Height 94.488 in (240.0 cm) Weight 4,010 lb (1,819 kg)Configuration
CVD - TITIN 8''OEM Model Description
The Centura TxZ is a chemical vapor deposition (CVD) system that is used for depositing thin films of various materials on semiconductor wafers. It can be used with 8” wafer size and CVD system size is also 8”. In September 1996, the Liner TxZ Centura system was launched. This system combines a new CVD TiN chamber with a Coherent PVD Ti chamber, and allows for deposition of sequential layers of Ti and CVD TiN in high-aspect-ratio metal structures under vacuum. In September 1996, the Liner TxZ Centura system was launched. This system combines a new CVD TiN chamber with a Coherent PVD Ti chamber, and allows for deposition of sequential layers of Ti and CVD TiN in high-aspect-ratio metal structures under vacuum.Documents
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CATEGORY
CVD
Last Verified: 4 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
147414
Wafer Sizes:
8"/200mm
Vintage:
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
CENTURA TxZ
CATEGORY
CVD
Last Verified: 4 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
147414
Wafer Sizes:
8"/200mm
Vintage:
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Development_CVD_TiTIN Minimum 200 mm Maximum 200 mm Exterior Dimensions Width 79.921 in (203.0 cm) Depth 98.425 in (250.0 cm) Height 94.488 in (240.0 cm) Weight 4,010 lb (1,819 kg)Configuration
CVD - TITIN 8''OEM Model Description
The Centura TxZ is a chemical vapor deposition (CVD) system that is used for depositing thin films of various materials on semiconductor wafers. It can be used with 8” wafer size and CVD system size is also 8”. In September 1996, the Liner TxZ Centura system was launched. This system combines a new CVD TiN chamber with a Coherent PVD Ti chamber, and allows for deposition of sequential layers of Ti and CVD TiN in high-aspect-ratio metal structures under vacuum. In September 1996, the Liner TxZ Centura system was launched. This system combines a new CVD TiN chamber with a Coherent PVD Ti chamber, and allows for deposition of sequential layers of Ti and CVD TiN in high-aspect-ratio metal structures under vacuum.Documents
No documents