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AXUS TECHNOLOGY G&P POLI-400L
    Description
    Lapping & Polishing
    Configuration
    No Configuration
    OEM Model Description
    The G&P Technology POLI-400L was designed to provide flexible CMP process capability for applications where ease of use, reliability, and a compact design are essential. Capable of working with substrates with up to 150mm diameter, the POLI-400L offers configuration choices in carrier type, conditioner technology, pad profiling, process measurement and monitoring systems. The POLI-400L utilizes an intuitive touch-screen user interface and a robust PLC control system that includes the multiple process steps and detailed process controls that users expect. Reliability and flexibility is further enhanced by relying on manual single substrate loading. The G&P Technology POLI-400L delivers high-value performance and research capability in a package that is compact and economical.
    Documents

    No documents

    verified-listing-icon

    Verified

    CATEGORY
    CMP

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    131524


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    AXUS TECHNOLOGY G&P POLI-400L

    AXUS TECHNOLOGY

    G&P POLI-400L

    CMP
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago

    AXUS TECHNOLOGY

    G&P POLI-400L

    verified-listing-icon
    Verified
    CATEGORY
    CMP
    Last Verified: Over 60 days ago
    listing-photo-022fc17f24ec44458b8c596877dabfaf-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    131524


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Lapping & Polishing
    Configuration
    No Configuration
    OEM Model Description
    The G&P Technology POLI-400L was designed to provide flexible CMP process capability for applications where ease of use, reliability, and a compact design are essential. Capable of working with substrates with up to 150mm diameter, the POLI-400L offers configuration choices in carrier type, conditioner technology, pad profiling, process measurement and monitoring systems. The POLI-400L utilizes an intuitive touch-screen user interface and a robust PLC control system that includes the multiple process steps and detailed process controls that users expect. Reliability and flexibility is further enhanced by relying on manual single substrate loading. The G&P Technology POLI-400L delivers high-value performance and research capability in a package that is compact and economical.
    Documents

    No documents

    Similar Listings
    View All
    AXUS TECHNOLOGY G&P POLI-400L

    AXUS TECHNOLOGY

    G&P POLI-400L

    CMPVintage: 0Condition: UsedLast Verified:Over 60 days ago