Description
POLISHERConfiguration
• Tool used in Co process • Factory Interface o WIP Delivery: OHT o 4 Position Wide with 2 Loadports o Loadport Type: Enhanced 25 wafer FOUP o E99 Carrier ID: HERMOS with RF o Atmospheric Robot: Kawasaki Single Arm Track Robot o Light Tower: RYGB Light Tower • Polisher Unit (Note: Consumables subject to availability) o Conditioner Head Type: LDF DDF3 on P1, P2, P3 o In Situ Metrology: Full Vision 2 in the 3 platens o Polisher Head Type: Metal Contour o Retaining Ring: Grooved TB PPS AEP o Membrane: Coated Silicon o 6-Port Upper Pneumatics Assembly o 3-Pronged wafer chuck o Input Station Backside Wash o PRI Wet Robot o Cleaner: BB1/BB2/ Vapor dryer (Desica cleaner) o # Scrubbers: 2 o Scrubber Delivery Type: 2 Chem in scrubber 1 and 2 o Hot DI SRD Wash: No o Inline Metrology: None o Slurry Delivery System: 3 Slurries/2 Chemicals o Slurry Dispense Arm: TSDA (tunable slurry dispense arm) • Factory Hookup / Facilities Information o 36” Cleaner Workspace o Cleaner Drain Manifold: 2 Lines o Electrical: 200/208 VAC; 50/60 Hz; 30mA GFCI o CE Mark / Compliant • Automation / Remote Options o 2 Touchscreen FPD Monitors o Monitor 1 Location: On Cart o Monitor 2 Location: At Factory Interface position 3 • Additional Information available upon requestOEM Model Description
The Applied Reflexion CMP system is Applied Materials' 300mm CMP platform delivering innovation and productivity for 100nm and beyond. Based on the production-proven Applied Mirra Mesa CMP architecture, the Applied Reflexion system offers 300mm processing capabilities for oxide, STI, polysilicon, tungsten, and copper applications. Titan Head technology delivers excellent dishing and erosion performance with better repeatability. The system's FullScan endpoint system enables superior process results by scanning the entire wafer. Applied Reflexion's cleaner offers a two-stage brush scrub with single-wafer megasonics in vertical orientation to minimize footprint. Its space efficient design also features factory automation and advanced process control with integrated film thickness metrology and particle monitoring options, as well as a dual wafer robot which increases tool throughput for thin films.Documents
CATEGORY
CMP
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
79947
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
REFLEXION
CATEGORY
CMP
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
79947
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available