Description
No descriptionConfiguration
- Pneumatic Block replaced with a SMC Solenoid Block - Wafer bonding at pressures 5e-5 to 3e-3 Torr and 50*C to 550*C - Works with the Karl Suss MA6 Aligner for aligned bonding - Forces up to 20 kN for 6" wafers available - Supports thermal compression and anodic bonding (up to 2000 V) - Computer controlled with Windows environment for saving data / recipes and running multiple recipe steps 2000 VintageOEM Model Description
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SUSS MicroTec / KARL SUSS
SB6
Verified
CATEGORY
Bonders
Last Verified: 10 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
94966
Wafer Sizes:
6"/150mm
Vintage:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
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SUSS MicroTec / KARL SUSS
SB6
CATEGORY
Bonders
Last Verified: 10 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
94966
Wafer Sizes:
6"/150mm
Vintage:
2000
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
- Pneumatic Block replaced with a SMC Solenoid Block - Wafer bonding at pressures 5e-5 to 3e-3 Torr and 50*C to 550*C - Works with the Karl Suss MA6 Aligner for aligned bonding - Forces up to 20 kN for 6" wafers available - Supports thermal compression and anodic bonding (up to 2000 V) - Computer controlled with Windows environment for saving data / recipes and running multiple recipe steps 2000 VintageOEM Model Description
None ProvidedDocuments
No documents