Description
Wafer BonderConfiguration
Cluster Frame, Process Module x4, Transfer, Pre-AlignerOEM Model Description
Wafer Bonding + Bond Alignment + Cleaning + Metal Oxide Removal + Plasma Activation Up to 200 mmDocuments
No documents
SUSS MicroTec / KARL SUSS
CBC200
Verified
CATEGORY
Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
96111
Wafer Sizes:
8"/200mm
Vintage:
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View AllSUSS MicroTec / KARL SUSS
CBC200
CATEGORY
Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
96111
Wafer Sizes:
8"/200mm
Vintage:
2013
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Wafer BonderConfiguration
Cluster Frame, Process Module x4, Transfer, Pre-AlignerOEM Model Description
Wafer Bonding + Bond Alignment + Cleaning + Metal Oxide Removal + Plasma Activation Up to 200 mmDocuments
No documents