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EVGroup (EVG) EVG520IS
    Description
    Wafer Bonder
    Configuration
    With: - Chiller - Pump Anodic bonding 4" and 6" tooling included
    OEM Model Description
    The EVG520-IS is a semi-automated wafer bonding system developed by EV Group (EVG). It is designed to handle wafers up to 200 mm in size, making it suitable for small-volume-production applications. The system's design has been improved based on customer feedback and EV Group's continuous technological innovations. One of its key features is the proprietary symmetric rapid heating and cooling chuck design, which ensures efficient and precise bonding processes. The EVG520-IS offers independent top- and bottom-side heaters, enabling high-pressure bonding capability and providing excellent material and process flexibility.
    Documents

    No documents

    EVGroup (EVG)

    EVG520IS

    verified-listing-icon

    Verified

    CATEGORY
    Bonders

    Last Verified: Over 30 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    78070


    Wafer Sizes:

    6"/150mm


    Vintage:

    Unknown

    Have Additional Questions?
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    Money Back Guarantee
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    Transaction Insured by Moov
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    EVGroup (EVG) EVG520IS

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    Vintage: 2006Condition: Used
    Last VerifiedOver 60 days ago

    EVGroup (EVG)

    EVG520IS

    verified-listing-icon
    Verified
    CATEGORY
    Bonders
    Last Verified: Over 30 days ago
    listing-photo-e1a0ef4bbb8a49b4aee79c550e62fada-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2046/e1a0ef4bbb8a49b4aee79c550e62fada/867ae0e105a744e8ad50c36b587ddb5c_4d2d4f4816ff4f60b6fe3afb42de8d54_mw.jpeg
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    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    78070


    Wafer Sizes:

    6"/150mm


    Vintage:

    Unknown


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Wafer Bonder
    Configuration
    With: - Chiller - Pump Anodic bonding 4" and 6" tooling included
    OEM Model Description
    The EVG520-IS is a semi-automated wafer bonding system developed by EV Group (EVG). It is designed to handle wafers up to 200 mm in size, making it suitable for small-volume-production applications. The system's design has been improved based on customer feedback and EV Group's continuous technological innovations. One of its key features is the proprietary symmetric rapid heating and cooling chuck design, which ensures efficient and precise bonding processes. The EVG520-IS offers independent top- and bottom-side heaters, enabling high-pressure bonding capability and providing excellent material and process flexibility.
    Documents

    No documents

    Similar Listings
    View All
    EVGroup (EVG) EVG520IS

    EVGroup (EVG)

    EVG520IS

    BondersVintage: 2006Condition: UsedLast Verified: Over 60 days ago
    EVGroup (EVG) EVG520IS

    EVGroup (EVG)

    EVG520IS

    BondersVintage: 0Condition: UsedLast Verified: Over 30 days ago
    EVGroup (EVG) EVG520IS

    EVGroup (EVG)

    EVG520IS

    BondersVintage: 2007Condition: RefurbishedLast Verified: Over 60 days ago