Description
The tool is in crate. condition: deinstalled last year and not in crates. vintage:2006 Location: in my warehouse Date of last maintenance: 2019 Price: $200K USDConfiguration
10KN bond pressure for thermo-compression bonding or anodic bondingOEM Model Description
The EVG520-IS is a semi-automated wafer bonding system developed by EV Group (EVG). It is designed to handle wafers up to 200 mm in size, making it suitable for small-volume-production applications. The system's design has been improved based on customer feedback and EV Group's continuous technological innovations. One of its key features is the proprietary symmetric rapid heating and cooling chuck design, which ensures efficient and precise bonding processes. The EVG520-IS offers independent top- and bottom-side heaters, enabling high-pressure bonding capability and providing excellent material and process flexibility.Documents
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EVGroup (EVG)
EVG520IS
Verified
CATEGORY
Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
63277
Wafer Sizes:
Unknown
Vintage:
2006
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EVGroup (EVG)
EVG520IS
CATEGORY
Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
63277
Wafer Sizes:
Unknown
Vintage:
2006
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
The tool is in crate. condition: deinstalled last year and not in crates. vintage:2006 Location: in my warehouse Date of last maintenance: 2019 Price: $200K USDConfiguration
10KN bond pressure for thermo-compression bonding or anodic bondingOEM Model Description
The EVG520-IS is a semi-automated wafer bonding system developed by EV Group (EVG). It is designed to handle wafers up to 200 mm in size, making it suitable for small-volume-production applications. The system's design has been improved based on customer feedback and EV Group's continuous technological innovations. One of its key features is the proprietary symmetric rapid heating and cooling chuck design, which ensures efficient and precise bonding processes. The EVG520-IS offers independent top- and bottom-side heaters, enabling high-pressure bonding capability and providing excellent material and process flexibility.Documents
No documents