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BESI / ESEC 2007 HS
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    ESEC 2007 HS is a die attacher manufactured by ESEC. Die attach, also known as die mount or die bond, is the process of attaching a silicon chip to the die pad or die cavity of the support structure (e.g., the leadframe) of a semiconductor package. There are two common die attach processes: adhesive die attach and eutectic die attach. Both of these processes use special die attach equipment and tools to mount the die.
    Documents

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    BESI / ESEC

    2007 HS

    verified-listing-icon

    Verified

    CATEGORY
    Bonders

    Last Verified: Over 60 days ago

    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    47622

    Wafer Sizes:

    Unknown

    Vintage:

    Unknown

    Have Additional Questions?
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    Similar Listings
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    BESI / ESEC 2007 HS

    BESI / ESEC

    2007 HS

    Bonders
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago
    BESI / ESEC 2007 HS

    BESI / ESEC

    2007 HS

    Bonders
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago

    BESI / ESEC

    2007 HS

    verified-listing-icon
    Verified
    CATEGORY
    Bonders
    Last Verified: Over 60 days ago
    listing-photo-f479b72f8f0e4578ab784affe2341ba1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44409/f479b72f8f0e4578ab784affe2341ba1/eedb5a1fe1024b7f8fc5dbc69c3cdc6a_238eb10ca60e40d0ba414cf953bc41711105c_mw.jpeg
    listing-photo-f479b72f8f0e4578ab784affe2341ba1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44409/f479b72f8f0e4578ab784affe2341ba1/34a69e5f3af24ea3aa6da6b6211594f9_fac431f97cda483b8ee886aeef1df96f1105c_mw.jpeg
    listing-photo-f479b72f8f0e4578ab784affe2341ba1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44409/f479b72f8f0e4578ab784affe2341ba1/5e9713951ccb47f2b2391301832983c4_a8dc4d62781a4fd3abb5b74769f66bb01105c_mw.jpeg
    listing-photo-f479b72f8f0e4578ab784affe2341ba1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44409/f479b72f8f0e4578ab784affe2341ba1/5b9ebf3b50f14b6b86f173b1a155fd99_8335a398797f423c81db51cde9121e981105c_mw.jpeg
    listing-photo-f479b72f8f0e4578ab784affe2341ba1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44409/f479b72f8f0e4578ab784affe2341ba1/ba2080d7e4b245478969377f429497fe_57bc8e8fe15a4d47a2442517a62b84a91105c_mw.jpeg
    listing-photo-f479b72f8f0e4578ab784affe2341ba1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44409/f479b72f8f0e4578ab784affe2341ba1/9ed1d4530674425983cb57160dc78314_1130c134f6614081a39e071b97a47aa71105c_mw.jpeg
    listing-photo-f479b72f8f0e4578ab784affe2341ba1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44409/f479b72f8f0e4578ab784affe2341ba1/db2bf46fbf524fb7b1f2de0b0a54e1d9_6bbee8e6bcc74cef86d658c108873dcf1105c_mw.jpeg
    listing-photo-f479b72f8f0e4578ab784affe2341ba1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44409/f479b72f8f0e4578ab784affe2341ba1/ca9780b1e5cd4c8fb7cd7ccb18893743_dc866773ee87464684ba0d28ba2a446e1105c_mw.jpeg
    listing-photo-f479b72f8f0e4578ab784affe2341ba1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44409/f479b72f8f0e4578ab784affe2341ba1/593bd19e941f4224b43ed6d0f1f6400f_d95acf4d92aa47939d0c926c41275e521105c_mw.jpeg
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    47622

    Wafer Sizes:

    Unknown

    Vintage:

    Unknown

    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    ESEC 2007 HS is a die attacher manufactured by ESEC. Die attach, also known as die mount or die bond, is the process of attaching a silicon chip to the die pad or die cavity of the support structure (e.g., the leadframe) of a semiconductor package. There are two common die attach processes: adhesive die attach and eutectic die attach. Both of these processes use special die attach equipment and tools to mount the die.
    Documents

    No documents

    Similar Listings
    View All
    BESI / ESEC 2007 HS

    BESI / ESEC

    2007 HS

    BondersVintage: 0Condition: UsedLast Verified: Over 60 days ago
    BESI / ESEC 2007 HS

    BESI / ESEC

    2007 HS

    BondersVintage: 0Condition: UsedLast Verified: Over 60 days ago