Description
No descriptionConfiguration
No ConfigurationOEM Model Description
ESEC 2007 HS is a die attacher manufactured by ESEC. Die attach, also known as die mount or die bond, is the process of attaching a silicon chip to the die pad or die cavity of the support structure (e.g., the leadframe) of a semiconductor package. There are two common die attach processes: adhesive die attach and eutectic die attach. Both of these processes use special die attach equipment and tools to mount the die.Documents
No documents
BESI / ESEC
2007 HS
Verified
CATEGORY
Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
94781
Wafer Sizes:
Unknown
Vintage:
Unknown
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Money Back Guarantee
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Transaction Insured by Moov
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Refurbishment Services
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BESI / ESEC
2007 HS
CATEGORY
Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
94781
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
ESEC 2007 HS is a die attacher manufactured by ESEC. Die attach, also known as die mount or die bond, is the process of attaching a silicon chip to the die pad or die cavity of the support structure (e.g., the leadframe) of a semiconductor package. There are two common die attach processes: adhesive die attach and eutectic die attach. Both of these processes use special die attach equipment and tools to mount the die.Documents
No documents