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ASM EAGLE XPRESS GOCU
    Description
    Functional and placed in an air-conditioned cleanroom environment from new.
    Configuration
    No Configuration
    OEM Model Description
    The ASM Eagle Xpress Gocu is a type of ball bonder used in the semiconductor industry. The power requirements for the ASM Eagle Xpress Gocu are 220 V, 7.2 A, 50/60 Hz, 1 Phase. A ball bonder is a type of semiconductor assembly equipment used for wire bonding. It is capable of ball bumping and customized looping profiles.
    Documents

    No documents

    ASM

    EAGLE XPRESS GOCU

    verified-listing-icon

    Verified

    CATEGORY

    Bonders
    Last Verified: Over 60 days ago
    Key Item Details

    Condition:

    Used


    Operational Status:

    Installed / Idle


    Product ID:

    90818


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown

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    ASM EAGLE XPRESS GOCU
    ASMEAGLE XPRESS GOCUBonders
    Vintage: 0Condition: Used
    Last Verified3 days ago

    ASM

    EAGLE XPRESS GOCU

    verified-listing-icon

    Verified

    CATEGORY

    Bonders
    Last Verified: Over 60 days ago
    listing-photo-a896fef35f394ce68c6764ad4dfa09b3-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/75889/a896fef35f394ce68c6764ad4dfa09b3/285da8b7665b48939b83044f683bc9e2_asmwirebonder_mw.jpg
    Key Item Details

    Condition:

    Used


    Operational Status:

    Installed / Idle


    Product ID:

    90818


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Functional and placed in an air-conditioned cleanroom environment from new.
    Configuration
    No Configuration
    OEM Model Description
    The ASM Eagle Xpress Gocu is a type of ball bonder used in the semiconductor industry. The power requirements for the ASM Eagle Xpress Gocu are 220 V, 7.2 A, 50/60 Hz, 1 Phase. A ball bonder is a type of semiconductor assembly equipment used for wire bonding. It is capable of ball bumping and customized looping profiles.
    Documents

    No documents

    Similar Listings
    View All
    ASM EAGLE XPRESS GOCU
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    ASM EAGLE XPRESS GOCU
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    BondersVintage: 2015Condition: UsedLast Verified: Over 60 days ago