Description
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The ASM Eagle Xpress Gocu is a type of ball bonder used in the semiconductor industry. The power requirements for the ASM Eagle Xpress Gocu are 220 V, 7.2 A, 50/60 Hz, 1 Phase. A ball bonder is a type of semiconductor assembly equipment used for wire bonding. It is capable of ball bumping and customized looping profiles.Documents
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ASM
EAGLE XPRESS GOCU
Verified
CATEGORY
Bonders
Last Verified: 17 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
103900
Wafer Sizes:
Unknown
Vintage:
Unknown
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EAGLE XPRESS GOCU
CATEGORY
Bonders
Last Verified: 17 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
103900
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The ASM Eagle Xpress Gocu is a type of ball bonder used in the semiconductor industry. The power requirements for the ASM Eagle Xpress Gocu are 220 V, 7.2 A, 50/60 Hz, 1 Phase. A ball bonder is a type of semiconductor assembly equipment used for wire bonding. It is capable of ball bumping and customized looping profiles.Documents
No documents