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ULVAC NA-8000
    Description
    NA 8000 Ashing
    Configuration
    No Configuration
    OEM Model Description
    The NA-8000 is a versatile ashing system that can remove anything from organic film to oxide film to SiN. It has a high dose ion implant stripping process and polymer removal process of 10E + 16 or higher level, necessary for critical processes for next-generation wafers. The chamber construction is arranged most suitably for an F-based gas addition process, allowing for particle-free treatment. The system construction is simple, achieving excellent maintainability and reliability, and low cost at the same time. It also allows for flexible system construction (μ wave, RIE, and μ wave + RIE) and easy wafer size change by simply changing the recipe setting. Overall, the NA-8000 is a powerful tool for removing anything and everything from your wafers.
    Documents

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    ULVAC

    NA-8000

    verified-listing-icon

    Verified

    CATEGORY
    Ashers

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    72903


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown

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    ULVAC NA-8000

    ULVAC

    NA-8000

    Ashers
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago

    ULVAC

    NA-8000

    verified-listing-icon
    Verified
    CATEGORY
    Ashers
    Last Verified: Over 60 days ago
    listing-photo-7e8fa06c83af48a1859661431b0abac0-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    72903


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    NA 8000 Ashing
    Configuration
    No Configuration
    OEM Model Description
    The NA-8000 is a versatile ashing system that can remove anything from organic film to oxide film to SiN. It has a high dose ion implant stripping process and polymer removal process of 10E + 16 or higher level, necessary for critical processes for next-generation wafers. The chamber construction is arranged most suitably for an F-based gas addition process, allowing for particle-free treatment. The system construction is simple, achieving excellent maintainability and reliability, and low cost at the same time. It also allows for flexible system construction (μ wave, RIE, and μ wave + RIE) and easy wafer size change by simply changing the recipe setting. Overall, the NA-8000 is a powerful tool for removing anything and everything from your wafers.
    Documents

    No documents

    Similar Listings
    View All
    ULVAC NA-8000

    ULVAC

    NA-8000

    AshersVintage: 0Condition: UsedLast Verified: Over 60 days ago