KLA-Tencor Corporation announced that it has completed its acquisition of the Microelectronic Inspection Equipment (MIE) business unit of Vistec Semiconductor Systems. 
Vistec Semiconductor Systems - MIE provides advanced semiconductor mask and wafer manufacturing systems. 

On February of 2006, Leica Microsystems' Semiconductor Equipment Division has a new name: Vistec Semiconductor Systems. The name change is a result Golden Gate Capital takeover of Leica's semiconductor business.

The INS3300 automated optical defect review and defect classification system incorporates UV and DUV optics for the highest resolution available on any optical review microscope. Fully automated and production-ready, the INS3300 defect classification system is user-friendly, ergonomic and reliable.

KLA / VISTEC / LEICA

INS3300

MIS 200

The Leica INS 3000 is the new defect review and inspection station. The all stainless-steel system features a fully automatic integrated microscope, including UV and Confocal, and universal wafer handler. The design priorities of the INS 3000 are ergonomy, cleanliness, automation and user-friendliness.The characteristics of the system are 1 to 3 cassette front loading, including SMIF, and a newly developed Windows™ NT based graphical user interface.

INS3000

INS2000

LDS 3300M

INS 10

MIS SP200

INS3300 DUV

LMS IPRO2

LWM9000

System enables fully automated inspection of the 300mm wafer surface. The system's parallel processing capability allows simultaneous wafer inspection of the front / backside and the edge/bevel – at throughputs of up to 130 wafers per hour. A single rotation of the wafer is sufficient for wafer edge inspection to deliver the detection results and defect images. The image-based technology convinces with 1µm sensitivity and allows for optional high resolution microscopic review of defects.

LDS3300 C

**PARTS**

VB6-UHR EWF

Vistec’s LMS IPRO4 is a fully automated mask metrology system designed to support mask metrology requirements of the 45nm node. It can measure registration and critical dimensions in transmitted or reflected light at i-line (365nm). The system is known for its measurement performance, reliability, user-friendly interface, and comprehensive data evaluation software. It can also be equipped with an optional 300mm wafer chuck to qualify pattern placement of wafer lithography tools. Key features include I-line UV-illumination, edge detection, registration long-term repeatability, full coverage of 230mm reticles and 300mm wafers, through pellicle measurement capability, mask rotation capability, and enhanced minienvironment stability.

LMS IPRO4

LWM200

INS1000

The Vistec LMS IPRO is a high-end device designed to support mask metrology for advanced technology nodes. It is a reticle pattern placement metrology system used to support the development of advanced reticle technology that will be used to pattern the most critical layers of the industry’s next-generation integrated circuits.

 LMS IPRO

LWM270 DUV

The next-generation system, the LMS IPRO5, is designed to support the stringent precision and repeatability requirements for pattern placement metrology of reticles supporting advanced lithography techniques and 3Xnm to 2Xnm node devices.

LMS IPRO5

The LMS IPRO7 reticle registration metrology system, introduced in September 2017, leverages a new operating mode to accurately measure on-device reticle pattern placement error with fast cycle time, enabling comprehensive reticle qualification for e-beam mask writer corrections and reduction of reticle-related contributions to device overlay errors in the IC fab.

LMS IPRO7

The new generation LDS3300 from Vistec Semiconductor Systems (previously Leica Microsystems Semiconductor GmbH) enables fully automated inspection of the 300mm wafer surface.
The system's parallel processing capability allows simultaneous wafer inspection of the front / backside and the edge/bevel – at throughputs of up to 130 wafers per hour. A single rotation of the wafer is sufficient for wafer edge inspection to deliver the detection results and defect images. The image-based technology convinces with 1µm sensitivity and allows for optional high resolution microscopic review of defects.

LDS3300

The INS3000 DUV is an automated optical defect review and classification system that combines the benefits of a conventional microscope with automation. It has a high resolution of up to 80nm, spanning visible, UV, and DUV wavelengths.

INS3000 DUV

LWM250

The LMS IPRO3 is a high-performance pattern placement and CD metrology system designed for use with masks and wafers of up to 300mm in size. Its flexible feature edge detection, which uses image analysis, allows engineers to solve a variety of day-to-day problems, such as process control on non-orthogonal features. Additionally, the system’s flexible and comprehensive data analysis software provides valuable information on pattern generator, process quality, and product quality. This makes the LMS IPRO3 an essential tool for ensuring the highest levels of precision and accuracy in the manufacturing process.

LMS IPRO3

 The optical resolution of the Leica LWM 250 UV CD metrology system it was necessary to reduce the illumination wavelength down to the 248 nm DUV range. 

 LWM250 UV

LWM250 DUV

VB6-HR

The VB300 targets nano-lithography e-beam direct write and next-generation mask applications, Vistec said, with the ability to load from piece parts as small as 5mm to full 300mm wafers with corresponding mask plate substrate sizes.

VB300

 The LMS IPRO6 system  is used by mask shops for comprehensive characterization of reticle pattern placement error, which is a direct contributor to wafer-level pattern overlay error. The LMS IPRO6 utilizes model-based metrology to accurately measure reticle registration for on-device pattern features and standard registration marks, producing higher sampling for better determination of mask quality.

 LMS IPRO6

The LDS 3000 allows fully automatic defect monitoring in all process steps. All types of yield limiting visual defects on single layer or multi-layer patterned wafers will be detected, including thin film-, photo-, -etch- and the cleaning-process will be detected. Beside the micro the LDS 3000 can be equipped optionally also with fully automatic macro inspection.

KLA / VISTEC / LEICA

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