Skip to main content
6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
Moov logo

6" Fab For Sale from Moov - Click Here to Learn More
Moov Icon

LDS3300

Overview

The new generation LDS3300 from Vistec Semiconductor Systems (previously Leica Microsystems Semiconductor GmbH) enables fully automated inspection of the 300mm wafer surface. The system's parallel processing capability allows simultaneous wafer inspection of the front / backside and the edge/bevel – at throughputs of up to 130 wafers per hour. A single rotation of the wafer is sufficient for wafer edge inspection to deliver the detection results and defect images. The image-based technology convinces with 1µm sensitivity and allows for optional high resolution microscopic review of defects.

Active Listings

0

Services

Inspection, Insurance, Appraisal, Logistics

Top Listings

    No products found
Have one like this?
List it with Moov and find the perfect buyer in no time at all.