Akrometrix has become the industry leader in real-time metrology, emphasizing resolution of thermo-mechanical issues at all levels of electronic materials production, components fabrication, and assembly processes.

AKROMETRIX

The Table Top Shadow Moiré (TTSM)  is a Production Floor Warpage Metrology System designed for quick and easy measurements, utilizing Akrometrix’s suite of software programs to allow for a variety of useful features to optimize and provide meaningful reports.

TTSM

The Table Top Shadow Moiré Metrology System with JEDEC Tray Autoloader (TTSM-J) provides ultra fast surface topography for up to two JEDEC trays full of samples. Utilizing Akrometrix’s patented Shadow Moiré technology, the TTSM is designed for those customers who need to measure various substrates for warpage in less than 2 seconds. Akrometrix’s suite of software programs to allow for a variety of useful features to optimize and provide meaningful reports. With high load repeatability or by using Akrometrix’s part tracking software, the TTSM-J can deliver high volume and high reliability component testing with multiple report output and pass/fail gauge options

TTSM-J

PS400

The AXP 2.0 Thermal Warpage System with Second Generation Digital Fringe Projection Vision Technology (AXP 2.0-DFP2) uses the Digital Fringe Projection 2 technique to measure a field of view up to 240mm x 192mm and down to 45mm x 36mm, with a measurement resolution down to 2.5 microns and 18 micron pixel sizes. This technique is particularly useful for measurement of connectors, sockets, BGA balls, and assembled modules, or any products with a discontinuous surface and varying step heights.

AXP 2.0-DFP2

The Table Top Digital Fringe Projection 2 (TTDFP2) system provides fast and accurate surface topography for discontinuous surfaces at room temperature. The TTDPF2 accommodates samples up to 450mm x 450mm, with a variable field of vision ranging from 45 x 36mm to 192 x 240mm. The TTDFP2 can handle virtually any substrate, capable of capturing up to 5.3 million data points measured in 1 second. With a z-resolution of down to 2.5 microns, the TTDFP2 can be placed on a table for quick and easy measurements, utilizing Akrometrix’s suite of software programs to allow for a variety of useful features to optimize and provide meaningful reports. 

TTDFP2

The TherMoiré® PS200S is a metrology solution that utilizes the Shadow Moiré measurement technique combined with automated phase-stepping to characterize out-of-plane displacement for samples up to 150 mm x 200 mm. With time-temperature profiling capability, the TherMoiré® PS200S captures a complete history of a sample’s behavior during a user-defined thermal excursion.

PS200S

The TherMoiré® PS600S is a metrology solution that utilizes the Shadow Moiré measurement technique combined with automated phase-stepping to characterize out-of-plane displacement for samples up to 600 mm x 600 mm. With time-temperature profiling capability, the TherMoiré® PS600S captures a complete history of a sample’s behavior during a user-defined thermal excursion.

PS600S

The TherMoiré® AXP 2.0 is a modular metrology solution that utilizes the Shadow Moiré measurement technique, combined with automated phase-stepping, to characterize out-of-plane displacement for samples up to 400 mm x 400 mm. With time-temperature profiling capability, the TherMoiré® AXP 2.0 captures a complete history of a sample’s behavior during a user-defined thermal profile. The combination of Shadow Moiré measurement and dynamic temperature profiling is the foundation of the patented TherMoiré® platform. Dynamic profiling is the most effective approach to analyze mechanical behavior induced by real-world processes and operating environments. Using the TherMoiré® AXP 2.0, engineers can gain a better understanding of the interactions between materials, packages, substrates and complete assemblies.

AXP 2.0

The AXP 2.0 Thermal Warpage System with Second Generation Digital Image Correlation Vision Technology (DIC) uses the Digital Imaging Correlation technique to measure a field of view up to 240mm x 192mm and down to 45mm x 36mm, with a measurement resolution down to 2.5 microns and 18 micron pixel sizes. This technique is particularly useful for measurement of connectors, sockets, BGA balls, and assembled modules, or any products with a discontinuous surface and varying step heights.

AXP 2.0-DIC

The days of measuring coplanarity with mechanical shim gauges at a few select points are gone. With the DFP2-LS End-of-Line Warpage system (DFP2-LS), coplanarity is measured across the entire surface of a fully populated PCB assembly after the post-reflow process. Utilizing Akrometrix newly released Digital Fringe Projection (DFP2) vision system, any Akrometrix Metrology System with this technology is capable of measuring a discontinuous surface with varying step heights over the entire field of view of the system. In the case of the DFP2-LS, the D.U.T can be a PCB as large as 585mm x 468mm, where the entire surface is measured in a matter of seconds, not minutes.

DFP2-LS

Table Top Shadow Moiré w/ JEDEC Autoloader and Scanner. The TTSM-JS provides ultra fast surface topography for up to two JEDEC trays full of samples. Utilizing Akrometrix’s patented Shadow Moiré technology, the TTSM-JS is designed for those customers who need to measure various substrates for warpage in less than 2 seconds. Akrometrix’s suite of software programs to allow for a variety of useful features to optimize and provide meaningful reports. The TTSM-JS features single push button activation for loading and measurement, as wall as scanning capabilities for QR codes, Barcodes, and Data Matrices.

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