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AXP 2.0-DIC
Category
Defect InspectionOverview
The AXP 2.0 Thermal Warpage System with Second Generation Digital Image Correlation Vision Technology (DIC) uses the Digital Imaging Correlation technique to measure a field of view up to 240mm x 192mm and down to 45mm x 36mm, with a measurement resolution down to 2.5 microns and 18 micron pixel sizes. This technique is particularly useful for measurement of connectors, sockets, BGA balls, and assembled modules, or any products with a discontinuous surface and varying step heights.
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