Description
Research Atomic Layer Deposition (ALD) Thin Film System TFS 200 Dimensions: total width: ca. 330 cm (+ laptop trolley 60cm) total depths: ca. 100 cm total hight: ca. 200 cm ALD, Glove box and airlock are connected. Laptop trolley can be freely moved or replaced.Configuration
• thermal or plasma enhance ALD • gas, liquid or solid precursors and carrier gasses, e.g. TMA, TiCl4, DEZ, TEMAH, H2O, NH3, O2, N3, Ar • up to 4 liquid sources • up to 8 gas lines • up to 200 mm wafers • substrate temperature range 25°C – 350°C • class 100 (ISO 5) clean-room compatible • water cooled cold-wall vacuum chamber + hot wall reaction chamber • glovebox for high purity sample loadingOEM Model Description
Beneq TFS 200 is the most flexible ALD research platform ever designed for academic research and corporate R&D. Beneq TFS 200 has specifically been designed to minimize any cross contamination that could happen in a multi-user research environment. The large number of available options and upgrades means that your Beneq TFS 200 will grow with you to meet even the most demanding research requirements. Beneq TFS 200 represents technical solutions that enable deposition of superior quality coatings on wafers, planar objects, porous bulk materials and complex 3D objects with very high aspect ratio (HAR) features. Direct and remote plasma-enhanced deposition (PEALD) is available in Beneq TFS 200 as a standard option. The plasma is capacitively-coupled (CCP), which is the industry standard today. The CCP plasma option offers both direct and remote plasma-enhanced ALD (PEALD) for substrates up to 200mm, face-up or face-down.Documents
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BENEQ
TFS 200
Verified
CATEGORY
ALD
Last Verified: 5 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
117178
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BENEQ
TFS 200
CATEGORY
ALD
Last Verified: 5 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
117178
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Research Atomic Layer Deposition (ALD) Thin Film System TFS 200 Dimensions: total width: ca. 330 cm (+ laptop trolley 60cm) total depths: ca. 100 cm total hight: ca. 200 cm ALD, Glove box and airlock are connected. Laptop trolley can be freely moved or replaced.Configuration
• thermal or plasma enhance ALD • gas, liquid or solid precursors and carrier gasses, e.g. TMA, TiCl4, DEZ, TEMAH, H2O, NH3, O2, N3, Ar • up to 4 liquid sources • up to 8 gas lines • up to 200 mm wafers • substrate temperature range 25°C – 350°C • class 100 (ISO 5) clean-room compatible • water cooled cold-wall vacuum chamber + hot wall reaction chamber • glovebox for high purity sample loadingOEM Model Description
Beneq TFS 200 is the most flexible ALD research platform ever designed for academic research and corporate R&D. Beneq TFS 200 has specifically been designed to minimize any cross contamination that could happen in a multi-user research environment. The large number of available options and upgrades means that your Beneq TFS 200 will grow with you to meet even the most demanding research requirements. Beneq TFS 200 represents technical solutions that enable deposition of superior quality coatings on wafers, planar objects, porous bulk materials and complex 3D objects with very high aspect ratio (HAR) features. Direct and remote plasma-enhanced deposition (PEALD) is available in Beneq TFS 200 as a standard option. The plasma is capacitively-coupled (CCP), which is the industry standard today. The CCP plasma option offers both direct and remote plasma-enhanced ALD (PEALD) for substrates up to 200mm, face-up or face-down.Documents
No documents