Description
possible exposure to GoldConfiguration
2.0 um, Extended Field, ghi-line Broadband Lens � Dual 1200 W Lamp Illuminator Universal Size/Warped Wafer Kit: 200, and 300mm. FOSB Cassette to Cassette Wafer Handling Wafer Thickness Handling from 0.4 mm to 2.0 mm PATMAX MVS Alignment System MVS Alignment Spectrum of 530 - 570 nm Lens Distortion Reference - No lens matching 6 Slot Reticle Stack, Manual Front Loading GEM HSMS Communications Power Source: 208 V three phase, 5 wire, 150 amp Environmental ChamberOEM Model Description
The ULTRATECH AP300 is a stepper and scanner system that can produce wafers of 200-300mm in size. It is built on Veeco’s customizable Unity Platform™, which delivers superior overlay, resolution, and side wall profile performance, enabling highly automated and cost-effective manufacturing. The AP300 is particularly well-suited for copper pillar, fan-out, through-silicon via (TSV), and silicon interposer applications. It also has numerous application-specific product features to enable next-generation packaging techniques, such as enhanced warped wafer handling, dual side alignment, and optical focus.Documents
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VEECO / ULTRATECH
AP300
Verified
CATEGORY
Lithography
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
18575
Wafer Sizes:
12"/300mm
Vintage:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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View AllVEECO / ULTRATECH
AP300
Verified
CATEGORY
Lithography
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
18575
Wafer Sizes:
12"/300mm
Vintage:
2006
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
possible exposure to GoldConfiguration
2.0 um, Extended Field, ghi-line Broadband Lens � Dual 1200 W Lamp Illuminator Universal Size/Warped Wafer Kit: 200, and 300mm. FOSB Cassette to Cassette Wafer Handling Wafer Thickness Handling from 0.4 mm to 2.0 mm PATMAX MVS Alignment System MVS Alignment Spectrum of 530 - 570 nm Lens Distortion Reference - No lens matching 6 Slot Reticle Stack, Manual Front Loading GEM HSMS Communications Power Source: 208 V three phase, 5 wire, 150 amp Environmental ChamberOEM Model Description
The ULTRATECH AP300 is a stepper and scanner system that can produce wafers of 200-300mm in size. It is built on Veeco’s customizable Unity Platform™, which delivers superior overlay, resolution, and side wall profile performance, enabling highly automated and cost-effective manufacturing. The AP300 is particularly well-suited for copper pillar, fan-out, through-silicon via (TSV), and silicon interposer applications. It also has numerous application-specific product features to enable next-generation packaging techniques, such as enhanced warped wafer handling, dual side alignment, and optical focus.Documents
No documents