Description
MISSING PARTS Contacts Rings and lip seals (Consumable) Anodes (Consumable)Configuration
Model: Raider 210 ECD Type: Electroplating Model Number: R310PD2(1SA2CFD1CAP)08(CuNi)03 SYSTEM GENERAL CONFIGURATION 3 X Cassette WIP 1 X Capsule (Backside Clean & Backside Bevel Etch), 2 X ECD (CFD3), 1 X SRD 1 X Linear Dual Arm Robot with Single Vacuum End effector 1 X ARU (Advanced Replenishment Unit) 2 X CDU (Chemical Delivery Unit) 2 x Heat Exchanger 1 x DI Boost Pump Unit Fire Suppression System with three CO2 bottles MAIN POWER 208 VAC, 3Phase, 4 Wires, 50/60 Hz COMPUTER & CONTROL 1 x WIP Computer, 1 X Module Computer, 1 X Robot Computer 1 X FUI (Front User Interface), 1X RUI (Rear User Interface) 502 Controller with WINDOWS EMBEDDED OS Tool Software Version is unknownOEM Model Description
The Raider™ ECD is a fourth-generation single wafer electrochemical deposition tool that delivers advanced metal processing in a small footprint. It is an automated, multi-process tool that is available with cluster modules for metrology, plating, and cleaning. The Raider™ incorporates programmable reactors and can provide an ECD seed layer, a full solution for copper fill with uniformity and film characteristics, and integrated removal of all backside, bevel, and edge copper contamination and seed layer edge exclusion etch. Additionally, in-situ anneal is available. This tool is designed to provide advanced metal processing capabilities in a compact and efficient package.Documents
APPLIED MATERIALS (AMAT) / SEMITOOL
RAIDER ECD
Verified
CATEGORY
Electro Plating
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
24213
Wafer Sizes:
8"/200mm
Vintage:
2004
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Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
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Refurbishment Services
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APPLIED MATERIALS (AMAT) / SEMITOOL
RAIDER ECD
Verified
CATEGORY
Electro Plating
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
24213
Wafer Sizes:
8"/200mm
Vintage:
2004
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
MISSING PARTS Contacts Rings and lip seals (Consumable) Anodes (Consumable)Configuration
Model: Raider 210 ECD Type: Electroplating Model Number: R310PD2(1SA2CFD1CAP)08(CuNi)03 SYSTEM GENERAL CONFIGURATION 3 X Cassette WIP 1 X Capsule (Backside Clean & Backside Bevel Etch), 2 X ECD (CFD3), 1 X SRD 1 X Linear Dual Arm Robot with Single Vacuum End effector 1 X ARU (Advanced Replenishment Unit) 2 X CDU (Chemical Delivery Unit) 2 x Heat Exchanger 1 x DI Boost Pump Unit Fire Suppression System with three CO2 bottles MAIN POWER 208 VAC, 3Phase, 4 Wires, 50/60 Hz COMPUTER & CONTROL 1 x WIP Computer, 1 X Module Computer, 1 X Robot Computer 1 X FUI (Front User Interface), 1X RUI (Rear User Interface) 502 Controller with WINDOWS EMBEDDED OS Tool Software Version is unknownOEM Model Description
The Raider™ ECD is a fourth-generation single wafer electrochemical deposition tool that delivers advanced metal processing in a small footprint. It is an automated, multi-process tool that is available with cluster modules for metrology, plating, and cleaning. The Raider™ incorporates programmable reactors and can provide an ECD seed layer, a full solution for copper fill with uniformity and film characteristics, and integrated removal of all backside, bevel, and edge copper contamination and seed layer edge exclusion etch. Additionally, in-situ anneal is available. This tool is designed to provide advanced metal processing capabilities in a compact and efficient package.Documents
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