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LAM RESEARCH CORPORATION 2300 VERSYS KIYO
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    Key Item Details

    Condition:Used

    Operational Status:

    Product ID:24359

    Wafer Sizes:12"/300mm

    Vintage:2014

    Description

    No description available

    Configuration

    Polysilicon Etch 11:36 1. 2300 PLATFORM (E) 1. 3 FOUP TDK 2. 3* Hermos Carrier ID 3. Light Curtain w/ OHT/RGV 4. 25 Slot Input Buffer Station 5. 25 Slot Aux Buffer (Corr Res) NSR101271,lnput buffer anti-corrosion 6. NSR101435,TM UPS bypass kit with Maratho 7. Conditioning Station (7 Wafer) 8. User Interface: Side and Front Monitor U 9. System UPS Circuitry 10. Earth Leakage Breaker 11. Cable: TM-Subpanel, 100ft 12. Signal Light Tower, R-O-G-B Slim Line 13. Sys Calibration and Alignment Software Variable ID 14. ATM Differential Pressure 15. APCS 16. VTM Breakout Board/Cover 17. Light Tower Buzzer 18. NSR9397, Female connectors for OHT 19. NSR10702, N2 Flow Monitoring on UPC 20. Metric to Inch Conv. Fittings 21. VTM Pump: Edwards (EPX) 22. NSR9943, Vespel for Airlock 23. NSR100972, SST Gas Filter 24. Vespel Single Sense 2. 4* 2300 VERSYS KIYO45 OPTIONS 1. 4* ESC Hose Kit: Low Temp with Shaft Seal 2. 4* OES Plus 3. 4* Sym. Liner Door (Improved) 4. 4* 2700 I/s BOCE Turbo Pump 5. 4* Chamber Manometer: Alternate (-011) 6. 4* NSR101186, 18ft TCP RF Cable on Kiyo45 7. 4* NSR10013, Kiyo45 Particle Reduction 8. 4* NSR6205, 3/4" swagelock connection 3. 2300 STRIP45 OPTIONS 1. 1* OES Endpoint Option 2. 1* Stainless Steel w/ 5/8 -1/2 Reducer 3. 1* Versys Kiyo45 Quick Clean kit 4. 2300 GAS BOX 1. 2300 VERSYS KIYO45 JETSTREAM GAS BOX 1. *4 9 Gas Configuration (JetStream) 2. 28*Jetstream Gas Line 3. 8*Heated Gas Line 4. 4*Non Standard MFC 5. 4*Gas System: PM Versys Kiyo45 NSR 1 2. 1* Facility Interface Box (System) 3. 16* Facility Interface Box (Per Line) 4. 1* Future PM Containment

    Documents
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    OEM Model Description

    The 2300 Versys Kiyo is a manufacturing tool designed for 65 nm and beyond. It provides excellent uniformity and defect control on a reliable wafer transport system. The symmetric chamber and radial tuning features produce uniform etch results for advanced devices. It employs proprietary technology for process repeatability, low defect, and metal contamination results. It supports conventional applications such as gate and shallow trench isolation (STI) and emerging applications such as high k dielectric removal, critical spacer etch, and lithography-enabling etch steps. The system can be upgraded from the 2300 Versys Star, providing an investment-extending strategy.

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