
Description
BUMP_BONDERConfiguration
No ConfigurationOEM Model Description
Bump BonderDocuments
No documents
SHINKAWA
SBB-1100
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
132692
Wafer Sizes:
8"/200mm
Vintage:
2013
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
BUMP_BONDERConfiguration
No ConfigurationOEM Model Description
Bump BonderDocuments
No documents