Description
Chip Bump BonderConfiguration
No ConfigurationOEM Model Description
Wire BonderDocuments
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SHINKAWA
SBB 410
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: 16 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
149508
Wafer Sizes:
Unknown
Vintage:
2002
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Chip Bump BonderConfiguration
No ConfigurationOEM Model Description
Wire BonderDocuments
No documents