Description
IConnPS PLUSTM is the new State-of-the-Art in Fully Automatic Wire Bonding. With its upgraded and enhanced subsystems, it is engineered to deliver all the capability you will need — for Wire Bonding today, PLUS tomorrow. To meet all leading edge wire bonding challenges, the IConn PLUS was designed with new capabilities and features in five key focusConfiguration
No ConfigurationOEM Model Description
Fully automatic wire bonder. ± 2.0 μm accuracy. High performance X-Y-Z motion control system. Dual-frequency transducer allows two selectable frequencies for each bond. Power Series Advanced Loops for tight control of the last kink height. On-board process optimization tools. 1pF Auto-BITS self-teach and optimization. WAVI (Wide Angle Vertical Illumination) system with programmable red and blue lighting. Optional programmable focus with a full 2.5 mm focus range. Optional copper wire bonding kitDocuments
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KULICKE & SOFFA (K&S)
IConn PLUS
Verified
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
79150
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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KULICKE & SOFFA (K&S)
IConn PLUS
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
79150
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
IConnPS PLUSTM is the new State-of-the-Art in Fully Automatic Wire Bonding. With its upgraded and enhanced subsystems, it is engineered to deliver all the capability you will need — for Wire Bonding today, PLUS tomorrow. To meet all leading edge wire bonding challenges, the IConn PLUS was designed with new capabilities and features in five key focusConfiguration
No ConfigurationOEM Model Description
Fully automatic wire bonder. ± 2.0 μm accuracy. High performance X-Y-Z motion control system. Dual-frequency transducer allows two selectable frequencies for each bond. Power Series Advanced Loops for tight control of the last kink height. On-board process optimization tools. 1pF Auto-BITS self-teach and optimization. WAVI (Wide Angle Vertical Illumination) system with programmable red and blue lighting. Optional programmable focus with a full 2.5 mm focus range. Optional copper wire bonding kitDocuments
No documents