Description
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Process: Wire Bonder Mode: Fully-autoOEM Model Description
Fully automatic wire bonder. ± 2.0 μm accuracy. High performance X-Y-Z motion control system. Dual-frequency transducer allows two selectable frequencies for each bond. Power Series Advanced Loops for tight control of the last kink height. On-board process optimization tools. 1pF Auto-BITS self-teach and optimization. WAVI (Wide Angle Vertical Illumination) system with programmable red and blue lighting. Optional programmable focus with a full 2.5 mm focus range. Optional copper wire bonding kitDocuments
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KULICKE & SOFFA (K&S)
IConn PLUS
Verified
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: Yesterday
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116477
Wafer Sizes:
8"/200mm, 12"/300mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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KULICKE & SOFFA (K&S)
IConn PLUS
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: Yesterday
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116477
Wafer Sizes:
8"/200mm, 12"/300mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Process: Wire Bonder Mode: Fully-autoOEM Model Description
Fully automatic wire bonder. ± 2.0 μm accuracy. High performance X-Y-Z motion control system. Dual-frequency transducer allows two selectable frequencies for each bond. Power Series Advanced Loops for tight control of the last kink height. On-board process optimization tools. 1pF Auto-BITS self-teach and optimization. WAVI (Wide Angle Vertical Illumination) system with programmable red and blue lighting. Optional programmable focus with a full 2.5 mm focus range. Optional copper wire bonding kitDocuments
No documents