Description
No descriptionConfiguration
Set up for Wedge Ribbon Wire Bond. Can be configured for normal capillary wire bond as well. -Mechatronic wedge-wedge bondhead, 45 degreeOEM Model Description
Fully automated fine wire bonders Wedge-wedge and ball-wedge bondheads Optimized pattern recognition (PR) Software features for the growing demand of connectivity and industry 4.0 (e.g. Hesse Bonder Network, remote control of PR, improved MES integration, …) Hesse Assist Tools: load cell, bondtool detection, bondtool calibration without wedge gauge for operator independencyDocuments
No documents
Verified
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: 17 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
150814
Wafer Sizes:
Unknown
Vintage:
2021
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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HESSE & KNIPPS
BONDJET 855
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: 17 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
150814
Wafer Sizes:
Unknown
Vintage:
2021
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Set up for Wedge Ribbon Wire Bond. Can be configured for normal capillary wire bond as well. -Mechatronic wedge-wedge bondhead, 45 degreeOEM Model Description
Fully automated fine wire bonders Wedge-wedge and ball-wedge bondheads Optimized pattern recognition (PR) Software features for the growing demand of connectivity and industry 4.0 (e.g. Hesse Bonder Network, remote control of PR, improved MES integration, …) Hesse Assist Tools: load cell, bondtool detection, bondtool calibration without wedge gauge for operator independencyDocuments
No documents