Description
Configured for aluminum only: 60° bond head, 1.2 mil wire, no handlers, just a vacuum stage.Configuration
No ConfigurationOEM Model Description
Fully automated fine wire bonders Wedge-wedge and ball-wedge bondheads Optimized pattern recognition (PR) Software features for the growing demand of connectivity and industry 4.0 (e.g. Hesse Bonder Network, remote control of PR, improved MES integration, …) Hesse Assist Tools: load cell, bondtool detection, bondtool calibration without wedge gauge for operator independencyDocuments
Verified
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: Today
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
145080
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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HESSE & KNIPPS
BONDJET 855
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: Today
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
145080
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available